Board-to-Board Connector Ground Sheet Layout for Crosstalk Shielding

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Solution Overview

Problem

Existing board-to-board connectors face challenges in reducing crosstalk among signals and maintaining structural strength due to limited space for forming slits and potential damage during processing.

Innovation Solution

Incorporating a first ground sheet with a main body portion covering the outer side surface and extending beyond the mounting surfaces, and a wave-absorbing material on the insulating body to minimize structural damage and improve signal quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If slits are opened on the insulating body to install ground isolation sheets, then ground shielding effect is improved, but structural strength of the insulating body deteriorates

Engineering Contradiction:
Improveground shielding effectVSAvoidstructural strength of insulating body
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The ground sheet is relocated from the traditional slit-based installation method to the outer side surface of the insulating body. This dimensional change allows the ground sheet to be mounted on the exterior surface rather than requiring internal slits, thereby maintaining the structural integrity of the insulating body while still achieving effective ground shielding between adjacent signal terminals.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If the insulating body is made thin to reduce connector profile, then compactness is improved, but difficulty in processing slits increases

Engineering Contradiction:
Improveconnector thicknessVSAvoiddifficulty in processing slits
Core Design Contradiction:
Volume of moving objectVSEase of manufacture

Solution Approach 1:

By moving the ground sheet installation to the outer side surface of the insulating body, the design eliminates the need to process slits through the thin insulating body. This allows the insulating body to maintain a thin profile for compactness while avoiding the manufacturing difficulties associated with cutting slits in thin materials.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Object-affected harmful factors

If ground sheet is installed between adjacent signal terminals, then crosstalk reduction is improved, but space requirements for terminal density deteriorates

Engineering Contradiction:
Improvecrosstalk among signalsVSAvoidspace for terminal density
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The ground sheet is repositioned from being installed between adjacent signal terminals (consuming horizontal space) to being mounted on the outer side surface of the insulating body (utilizing vertical/exterior space). This dimensional relocation maintains effective ground shielding for crosstalk reduction while preserving terminal density by not occupying space between signal terminals.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20260011942A1Board-to-board connector with improved ground features
Publication Date: 2026.01.08 LUXSHARE PRECISION IND SHENZHEN
  • US20260011942A1 patent drawing
  • US20260011942A1 patent drawing
  • US20260011942A1 patent drawing

AI summary

A board-to-board connector includes an insulating body, a number of conductive terminals and a first ground sheet. The insulating body includes a first mounting surface, a second mounting surface and a terminal installation area. The terminal installation area includes a first outer side surface. The conductive terminals are mounted to the terminal installation area. The conductive terminal includes a first contact elastic arm extending beyond the first mounting surface and a second contact elastic arm extending beyond the second mounting surface. The first ground sheet is fixed to the insulating body. The first ground sheet includes a first main body portion covering at least part of the first outer side surface.