Connector Assembly Ground Spring Low-Impedance EMC Path

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Solution Overview

Problem

Electronic devices face challenges in meeting demanding electromagnetic compatibility (EMC) requirements due to high impedance between external connectors, which can lead to increased electromagnetic interference in noisy environments.

Innovation Solution

A connector assembly featuring a ground spring and bracket that electrically and mechanically couples exterior metallic shells and bodies of connectors, forming a low-impedance ground path between mating connectors, thereby improving EMC performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional connector assemblies are used without a dedicated ground path, then the device structure remains simple, but the ground impedance between connectors is high, leading to poor EMC performance

Engineering Contradiction:
ImproveEMC performanceVSAvoidconnector assembly structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The ground connection is segmented into multiple paths: a ground spring provides direct contact between connectors, while a bracket provides structural support and alternative ground path. This segmentation ensures low impedance while maintaining structural integrity without requiring complex integrated solutions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A ground spring acts as an intermediary element between the first and second connectors, providing a dedicated low-impedance ground path. The spring mechanically and electrically couples the connectors without requiring direct metal-to-metal contact between the connector housings themselves.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If a low-impedance ground path is implemented between connectors, then EMC performance is improved, but the connector assembly complexity increases due to additional components

Engineering Contradiction:
Improveelectromagnetic interferenceVSAvoidconnector assembly structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The bracket serves multiple functions: it provides structural support for the connectors, establishes mechanical alignment, and creates an additional ground path between connectors. This multi-functionality reduces the need for separate dedicated ground structures, minimizing overall complexity while effectively reducing electromagnetic interference.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The ground spring uses spring pressure to maintain optimal electrical contact pressure between connectors, dynamically adjusting the contact parameters to ensure low impedance across different assembly conditions and tolerances, thereby reducing electromagnetic interference without requiring precision fixed-positioning structures.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the ground spring is positioned within the receiving cavity, then ground contact is achieved with the plug portion, but the spring arm may interfere with signal contacts

Engineering Contradiction:
Improveground connectionVSAvoidconnector mating
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The ground spring is positioned specifically at the distal end within the receiving cavity to contact only the plug portion ground, while the signal contacts remain in separate locations. This localized positioning ensures reliable ground connection without interfering with signal contact operation, as each contact area maintains its functional independence.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The spring arm is designed to be flexible and resilient, allowing it to deflect and accommodate variations in plug insertion depth and angle. This dynamic characteristic enables the ground spring to maintain reliable contact with the plug portion while naturally avoiding interference with rigid signal contacts that remain in fixed positions.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The low-impedance ground path enhances the EMC performance of electronic devices by reducing electromagnetic interference, making them more compatible with other devices in noisy environments.

Implementation Method 1

A ground spring is coupled to the exterior metallic shell and has at least one spring arm with a distal end that is positioned within the receiving cavity

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

In various embodiments the ground spring is welded to the exterior metallic shell and welded to the bracket

Methodology Applied
Scientific EffectWelding: Welding

Data Source

PatentUS20210098944A1Connector assembly having a low-impedance ground connection
Publication Date: 2021.04.01 APPLE INC
  • US20210098944A1 patent drawing
  • US20210098944A1 patent drawing
  • US20210098944A1 patent drawing

AI summary

An accessory for an electronic device includes a plug connector that is configured to connect to an electronic device when the electronic device is received by the accessory. The accessory also includes a receptacle connector at an exterior surface for coupling the accessory to a charging system when a mating connector is received within a receiving cavity of the receptacle connector. A bracket electrically and mechanically couples the plug connector to the receptacle connector. A ground spring is coupled to an exterior metallic shell of the receptacle connector and has a pair of spring arms that each have a distal end positioned within the receiving cavity such that when a mating plug connector is received within the receiving cavity a low-impedance ground path is formed between the mating connector and the plug connector.