Multilayer Wiring Board Connector Grounding Plate Positioning

The grounding component is merged with the printed circuit board to form an integrated structure. The grounding plate is formed directly on the PCB surface through conductive patterns, eliminating the need for separate attachment. This integration ensures that the grounding contacts and pads maintain consistent positioning relative to other connector components, resolving the positioning accuracy issue while preserving manufacturability through standard PCB fabrication processes.

The grounding component is merged with the printed circuit board using standard PCB fabrication techniques. Conductive patterns are formed on the PCB surface through conventional processes such as copper plating and solder mask application, which are already part of standard PCB manufacturing. This approach integrates the grounding function without requiring additional manufacturing steps or complex processes, thereby improving positioning accuracy while maintaining manufacturing simplicity.

The housing structure serves multiple functions: it provides mechanical support, guides the connector assembly, and positions the grounding component relative to other parts. By integrating the guiding function into the existing housing rather than adding a separate guide member, the design achieves the required alignment and positioning accuracy without increasing device complexity or the number of components.