Cable Connector Grounding Structure for Shielded Cable Soldering

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Solution Overview

Problem

The shielding layers of coaxial cables in conventional cable connector assemblies are difficult to be soldered to the circuit board, leading to soldering defects and inadequate anti-interference capabilities.

Innovation Solution

A cable connector assembly with a grounding structure that includes a base portion and clamping portions to clamp the shielding layers of low-speed signal cables, allowing for improved grounding and anti-interference capabilities, while using a hot-bar process for high-speed signal cables.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the shielding layer is soldered to the circuit board by the hot-bar process, then the coaxial cables can be soldered in one time, but the shielding layer dispersing and diverging conditions occur causing soldering defects

Engineering Contradiction:
Improvesoldering efficiencyVSAvoidsoldering quality
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent introduces a grounding wire as an intermediary component between the shielding layer and the circuit board. Instead of directly soldering the braided shielding layer to the PCB, the grounding wire serves as a mediator that connects to both the shielding layer and the grounding pad, eliminating the dispersing and diverging problems while maintaining efficient grounding.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent extracts the grounding function from the shielding layer itself and separates it into a dedicated grounding wire component. This allows the shielding layer to maintain its original braided structure for electromagnetic interference protection, while the grounding wire provides a reliable, focused connection path to the circuit board without suffering from the mesh structure's soldering difficulties.

Inventive Principle:
Principle #2Taking out (Extraction)

2Object-affected harmful factors

If the shielding layer is made of braided mesh shape, then the anti-interference effect is achieved, but the soldering process becomes difficult and causes defects

Engineering Contradiction:
Improveanti-interference capabilityVSAvoidsoldering ease
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The grounding wire acts as an intermediary that connects to the braided shielding layer without requiring direct soldering of the mesh structure to the PCB. The grounding wire can be easily soldered to the shielding layer's braid and then connected to the circuit board, combining the anti-interference benefits of the braided structure with ease of manufacturing.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent separates the shielding function (performed by the braided mesh) from the grounding connection function (performed by the dedicated grounding wire). This extraction allows each component to be optimized independently: the braided structure provides electromagnetic protection while the grounding wire provides reliable, easy soldering connection.

Inventive Principle:
Principle #2Taking out (Extraction)

3Area of stationary object

If the grounding structure volume is reduced, then the wire layout range is increased, but the grounding effectiveness may be compromised

Engineering Contradiction:
Improvewire layout rangeVSAvoidgrounding effectiveness
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The grounding structure is segmented into distinct functional components: the grounding wire that connects to the shielding layer, the insulation layer that provides electrical isolation, and the connection point on the circuit board. This segmentation allows for compact arrangement while maintaining effective grounding through proper positioning of each segment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses an insulation layer (thin film structure) to wrap around the grounding wire and shielding layer connection. This thin film provides necessary electrical isolation without adding significant volume, allowing compact grounding structure design that maintains both grounding effectiveness and maximizes wire layout space.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The grounding structure effectively connects the shielding layers of low-speed signal cables to the circuit board, enhancing anti-interference capabilities and reducing soldering defects, while increasing the wire layout range and reducing the volume of the grounding structure.

Implementation Method 1

melt the soldering pastes by heating, fore example, the soldering pastes pass through a reflow oven

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

melt the soldering pastes by heating

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 3

The base portion is electrically conductive with the low-speed signal grounding section

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS12592503B2Cable connector assembly
Publication Date: 2026.03.31 CHENG UEI PRECISION IND CO LTD
  • US12592503B2 patent drawing
  • US12592503B2 patent drawing
  • US12592503B2 patent drawing

AI summary

A cable connector assembly includes a circuit board, a grounding structure and two low-speed signal cables. The circuit board has an upper surface, and a lower surface opposite to the upper surface. The upper surface is provided with a low-speed signal grounding section and a first low-speed signal conducting section. The lower surface is provided with a second low-speed signal conducting section. The grounding structure is fastened on the circuit board. The two low-speed signal cables include a first low-speed signal cable and a second low-speed signal cable. The first low-speed signal cable and the second low-speed signal cable are mounted to the upper surface and the lower surface of the circuit board, respectively. The first low-speed signal cable and the second low-speed signal cable are disposed oppositely along an up-down direction.