Connector Head Projection Layout for Conductive Adhesive Thickness Control
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Solution Overview
Problem
Conventional semiconductor devices face challenges in securing a reliable thickness of conductive adhesive, such as solder, while minimizing its usage to prevent solder bridges and ensure current path width, especially when handling large current capacities.
Innovation Solution
The use of a configuration with second and first projections allows for controlled thickness and reduced adhesive usage, with the second projection enhancing the current path width and the first projection optimizing adhesive placement to prevent cracking and ensure balanced contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the conductive adhesive is increased to prevent cracking at peripheral edges, then reliability is improved, but the amount of conductive adhesive required increases
Solution Approach 1:
The invention applies different thickness requirements of conductive adhesive to different regions: the peripheral edge region requires increased thickness to prevent cracking, while the central region maintains appropriate thickness to avoid solder bridges. This localized differentiation resolves the contradiction by optimizing adhesive distribution according to functional requirements of each area.
Solution Approach 2:
The connection area is divided into distinct regions (peripheral edge region and central region) with different adhesive thickness characteristics. This segmentation allows independent optimization of each region's adhesive layer to meet its specific reliability and quantity requirements.
2Reliability
If the coating amount of conductive adhesive is increased to secure reliability tolerance, then reliability is improved, but the risk of solder bridge between electrodes increases
Solution Approach 1:
The invention implements local quality control by restricting increased adhesive thickness specifically to the peripheral edge region where reliability tolerance is needed, while maintaining controlled thickness in the central region where solder bridge prevention is critical. This spatial differentiation simultaneously achieves both reliability improvement and solder bridge risk reduction.
3Power
If the size of semiconductor element or connector is increased to handle large current capacity, then current handling capability is improved, but the thickness of conductive adhesive must be increased further
Solution Approach 1:
For large current capacity applications requiring larger semiconductor elements or connectors, the invention applies increased adhesive thickness only at the peripheral edges of these larger components, rather than uniformly across the entire increased area. This localized approach maintains current handling capability while minimizing the additional adhesive quantity required.
Data Source
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AI summary
An electronic device has a sealing part 90, an electronic element 95 provided in the sealing part 90 and a connection body 50 having a head part 40 connected to a front surface of the electronic element 95 via a conductive adhesive 75. The head part 40 has a second projection protruding 42 toward the electronic element 95 and a first projection 41 protruding from the second projection 42 toward the electronic element 95.