Electrical Connector Bracket with Heat Dissipation Grooves
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Solution Overview
Problem
Existing electrical connectors suffer from poor heat dissipation due to solid walls between card edge slots, hindering effective thermal management.
Innovation Solution
The electrical connector design incorporates a bracket with lateral mating frames and heat dissipation grooves between frames, featuring heat dissipation fins that open in the front-rear direction, along with transition modules for improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solid walls are used between card edge slots, then structural strength is improved, but heat dissipation deteriorates
Solution Approach 1:
The solid wall between card edge slots is segmented into a lattice structure consisting of multiple interconnected struts. This segmentation maintains the overall structural strength while creating multiple pathways for heat dissipation and airflow, effectively resolving the contradiction between structural integrity and thermal management.
Solution Approach 2:
The wall structure is transformed from a solid non-porous form to a porous lattice structure with controlled voids and channels. This porous configuration allows heat to dissipate more efficiently through convection and radiation while still providing sufficient mechanical support, thus improving heat dissipation without significantly compromising structural strength.
2Temperature
If heat dissipation grooves are added between frames, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The heat dissipation grooves are merged with the existing bracket structure between frames, forming an integrated component rather than a separate addition. The grooves are incorporated into the bracket's geometry, allowing heat dissipation functionality to be achieved without adding separate complex components, thus minimizing the increase in device complexity.
Solution Approach 2:
The bracket structure serves multiple functions: it provides structural support, defines the card edge slots, and now also serves as a heat dissipation pathway through the integrated grooves. This multi-functionality reduces the need for additional dedicated heat dissipation components, thereby limiting the increase in device complexity while achieving improved heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation performance by increasing the thermal contact area and airflow, resulting in better heat management and structural stability.
Implementation Method 1
the bracket defines a plurality of heat dissipation grooves each located between two adjacent frames and a plurality of heat dissipation fins each located in a corresponding heat dissipation groove
Implementation Method 2
transition modules inserted forward to be at least partially accommodated in the mating frame for electrically connecting the card and the printed circuit board
Data Source
AI summary
An electrical connector includes a bracket having a plurality of mating frames arranged side by side in a lateral direction and opening forward and plural transition modules inserted forward to be at least partially accommodated in the mating frame, wherein the bracket defines plural heat dissipation grooves each located between two adjacent frames and plural heat dissipation fins each located in a corresponding heat dissipation groove, the heat dissipation groove opening through in a front-rear direction.