Connector Heat Dissipation Structure Integration

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Electronic devices face challenges in heat dissipation and size reduction due to increasing requirements for reliability and thinness, with existing technologies failing to efficiently manage heat generation while maintaining compact designs.

Innovation Solution

The electronic device incorporates a connector with conductive and heat dissipation structures that are physically and electrically separated, a heat sink connected to the heat dissipation structure, and a manufacturing method that integrates the heat sink within the connector to enhance heat dissipation efficiency, reducing the need for additional heat dissipation devices and minimizing device size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat sink is integrated within the connector, then heat dissipation efficiency is improved and device size is reduced, but the connector structure becomes more complex

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidconnector structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipation structure is merged with the connector body, forming an integrated component rather than separate parts. The connector includes both conductive structures for electrical connection and heat dissipation structures thermally coupled to electronic components, combining electrical and thermal functions in a single integrated structure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The connector is designed to perform multiple functions simultaneously: electrical connection through conductive structures and heat dissipation through integrated heat dissipation structures. This multi-functional design eliminates the need for separate heat dissipation devices, reducing overall device complexity despite the enhanced capabilities.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Volume of moving object

If the heat sink is integrated within the connector, then the overall device size is reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improvedevice sizeVSAvoidintegration precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The heat dissipation structure is formed as an integral part of the connector during the same manufacturing process, eliminating the need for separate assembly steps. This integration reduces the number of components and assembly operations, thereby reducing overall device size while managing manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat dissipation structures are pre-formed as part of the connector structure before electronic components are mounted. This preliminary integration ensures proper thermal coupling is established during the manufacturing process itself, reducing the need for additional precision adjustments during assembly.

Inventive Principle:

Principle #10Preliminary action

3Temperature

If conductive and heat dissipation structures are physically separated and electrically insulated, then thermal management is improved, but the connector design becomes more complex

Engineering Contradiction:

Improvethermal managementVSAvoidconnector design

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The connector is segmented into distinct conductive structures and heat dissipation structures that are physically separated and electrically insulated from each other. This segmentation allows independent optimization of electrical connection and thermal management functions while maintaining clear functional boundaries within the integrated connector design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Electrically insulating materials or structures are used as intermediaries between the conductive and heat dissipation structures. These intermediaries enable thermal energy transfer while preventing electrical current flow, allowing the connector to simultaneously achieve electrical isolation and thermal coupling between different functional elements.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration increases heat dissipation efficiency, reduces the overall size of the electronic device by integrating the heat sink within the connector, and allows for improved thermal management without requiring large external heat dissipation components.

Implementation Method 1

The heat dissipation structure and the electronic component are in direct contact with each other... the heat sink is connected to the at least one first heat dissipation structure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230178452A1Electronic device and manufacturing method thereof

Publication Date: 2023.06.08 INNOLUX CORP

AI summary

An electronic device and a manufacturing method thereof are disclosed. The electronic device includes a connector, an electronic component, and a heat sink. The connector has at least one conductive structure and at least one first heat dissipation structure. The at least one conductive structure and the at least one first heat dissipation structure are physically separated and electrically insulated from each other. The electronic component is electrically connected to the at least one conductive structure. The heat sink is connected to the at least one first heat dissipation structure. The heat sink and the electronic component are disposed on opposite sides of the connector.