Connector Heat Sink Thermal Diffusing Unit
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for cooling optical modules or ICs in high-speed data transmission cables, such as using thermal pastes or conductive sheets, result in insufficient thermal conductivity due to the material's rigidity, leading to low heat dissipation efficiency.
Innovation Solution
A connector with a heat sink that incorporates a thermal diffusing unit and a first heat sink with a larger heat transfer coefficient, expanding the heat conducting area and allowing heat to be dissipated through exposed cooling fins, thereby enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal case with sufficient rigidity is used to withstand external forces, then the structural strength is improved, but the thermal conductivity becomes insufficient
Solution Approach 1:
The patent introduces a thermal diffusing unit as an intermediary component between the heating source and the metal case. This thermal diffusing unit has high thermal conductivity and serves as a mediator to transfer heat efficiently from the small contact area to a larger area of the case, overcoming the insufficient thermal conductivity of the rigid metal case material itself.
Solution Approach 2:
The patent extends heat dissipation from a two-dimensional surface contact to a three-dimensional structure by adding thermal diffusing units that conduct heat through the thickness of the case and by incorporating cooling fins that protrude outward. This dimensional extension increases the effective heat dissipation area and improves thermal management.
2Reliability
If thermal paste or thermal conductive sheet is applied to contact a metal case, then the heat transmission path is established, but the heat transmission area remains small
Solution Approach 1:
The patent transitions from two-dimensional surface contact to three-dimensional heat dissipation by incorporating cooling fins that extend outward from the case. This increases the heat transmission area from merely the contact surface to include the lateral surfaces of the fins, providing much larger area for heat dissipation to the surrounding environment.
Solution Approach 2:
The patent divides the heat dissipation function into multiple segments: the thermal diffusing unit conducts heat internally, while multiple cooling fins provide distributed external heat dissipation surfaces. This segmentation allows heat to be transmitted and dissipated across multiple separated areas rather than a single concentrated contact point.
3Device complexity
If the heat is transmitted only to the contact area of the case, then the thermal paste or conductive sheet structure is simple, but the heat dissipation efficiency is low
Solution Approach 1:
The patent adds a third dimension to heat dissipation by incorporating cooling fins that protrude from the case surface. This transforms the heat dissipation from a two-dimensional surface contact problem to a three-dimensional structure with increased surface area, dramatically improving heat dissipation efficiency without significantly complicating the overall device structure.
Solution Approach 2:
The thermal diffusing unit acts as an intermediary that bridges the heating source and the case structure, efficiently distributing heat to multiple cooling fins. This intermediary component enables high heat dissipation efficiency while maintaining relative structural simplicity by concentrating the thermal management function in a dedicated component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation efficiency by increasing the heat conducting area and allowing sequential heat transfer from the thermal diffusing unit and first heat sink to the air outside, effectively addressing the limitations of conventional cooling methods.
Implementation Method 1
The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case.
Implementation Method 2
The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case.
Implementation Method 3
The first heat sink has a base board, multiple first cooling fins, and multiple first cooling wind passages. The first cooling fins are formed on the second surface of the base board and extend toward a direction away from the base board.
Data Source
AI summary
A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.