Connector Heat Spreader with Compliant Cold Blocks

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Solution Overview

Problem

High data rate connectors, particularly powered cable systems, face challenges in thermal management due to the need for efficient cooling of modules that require significant energy dissipation, where traditional heat sinks with flat surfaces often result in inadequate contact and increased thermal resistance.

Innovation Solution

A connector system incorporating a heat spreader that directs thermal energy to spaced thermal plates, with cold blocks providing low thermal resistance coupling, allowing for compact configurations and effective heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional flat heat sinks are used to cool high data rate connectors, then thermal management is attempted, but thermal resistance increases due to inadequate contact between the heat sink and module surfaces

Engineering Contradiction:
Improvethermal managementVSAvoidthermal resistance
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent replaces traditional flat heat sink surfaces with compliant thermal contacts that have curved or flexible surfaces. This allows the thermal contacts to conform to the module surface irregularities, ensuring continuous contact and reducing thermal resistance. The compliant nature of the thermal contacts enables them to adapt to surface variations that would prevent effective heat transfer with rigid flat surfaces.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent changes the physical parameters of the thermal contact interface by using compliant materials with adjustable hardness and elasticity. This allows optimization of the contact pressure and contact area between the heat sink and module, thereby reducing thermal resistance. The compliant thermal contacts can deform to fill gaps and ensure intimate contact, fundamentally changing the interface characteristics compared to traditional rigid flat surfaces.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If cooling solutions are added to powered cable systems, then thermal management capability is improved, but device complexity increases

Engineering Contradiction:
Improvecooling capabilityVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the thermal management function with the existing connector structure by integrating compliant thermal contacts directly into the connector housing or module interface. Rather than adding separate cooling components, the design merges heat dissipation functionality with the mechanical interface, allowing thermal management to occur through the existing structural elements modified with compliant thermal contact features.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The compliant thermal contacts are designed to automatically conform to the module surface upon insertion, requiring no manual adjustment or complex control mechanisms. The elastic or viscoelastic material properties enable the thermal contacts to self-adjust and maintain optimal contact pressure, providing passive thermal management that reduces system complexity while maintaining effective cooling.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves superior thermal performance with reduced thermal resistance, enabling efficient heat dissipation while maintaining a compact design, suitable for high data rate applications.

Implementation Method 1

The heat spreader is configured to direct heat from ports to a thermal plate that is spaced apart from the connector

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

Cold blocks can be used to thermally couple the heat spreader to the corresponding thermal plates

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11171443B2Connector system with thermal cooling
Publication Date: 2021.11.09 MOLEX INC
  • US11171443B2 patent drawing
  • US11171443B2 patent drawing
  • US11171443B2 patent drawing

AI summary

A connector includes a heat spreader. The heat spreader is configured to direct heat from ports to a thermal plate that is spaced apart from the connector. A plurality of connectors can be supported and a heat spreader can be associated with each connector. One or more thermal plates can be thermally coupled to the corresponding heat spreader(s) so as to direct thermal energy away from each connector. Cold blocks can be used to thermally couple the heat spreader to the corresponding thermal plates.