Connector Height Matching Level Difference for Narrow Pitch Packaging
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Solution Overview
Problem
The wirebonding method becomes increasingly difficult due to the narrowing pitch of IC chip terminals and wiring patterns, making it challenging to connect piezoelectric elements and driving circuits in droplet ejection heads, especially as the nozzle pitch decreases, leading to reliability issues and reduced workability.
Innovation Solution
A device package structure with a base body having a conductive connection portion and a level difference portion, where a connector with a height matching or exceeding the level difference portion is used to facilitate reliable electrical connections, allowing for efficient packaging and connection of devices without the need for wirebonding, even at narrow pitches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the nozzle pitch is reduced to improve image definition and miniaturize the microdevice, then the resolution and compactness are improved, but the distance between piezoelectric elements becomes smaller making wirebonding connection difficult
Solution Approach 1:
The patent replaces the mechanical wirebonding connection system with a direct electrical connection system using conductive connection portions formed on the base body. Instead of using wires to connect piezoelectric elements to the driving circuit, the invention integrates conductive paths directly into the base body structure, allowing electrical connections to be made through the base body itself rather than through external wire bonds. This substitution eliminates the space requirements and manipulation difficulties associated with wirebonding in narrow pitch configurations.
2Volume of moving object
If the pitch of IC chip external connection terminals and wiring patterns is reduced to achieve high integration, then the compactness is improved, but the wirebonding connection workability deteriorates
Solution Approach 1:
The invention replaces the manual or automated wirebonding mechanical process with a direct electrical connection approach using conductive connection portions. The conductive connection portions are formed as integral parts of the base body, allowing electrical connections to be established through direct contact or bonding to these conductive areas rather than requiring wire manipulation. This eliminates the operational difficulties of wirebonding in high-integration, narrow-pitch configurations.
3Volume of moving object
If the distance between piezoelectric elements is reduced to match the nozzle pitch, then the miniaturization is improved, but the wirebonding connection reliability deteriorates
Solution Approach 1:
The patent replaces the wirebonding connection system with direct electrical connections through conductive connection portions formed on the base body. The conductive connection portions provide stable, rigid electrical pathways that are not subject to the mechanical stresses and alignment tolerances that limit wirebonding reliability. This direct connection approach through the base body structure maintains high connection reliability even when piezoelectric elements are spaced at very small distances corresponding to narrow nozzle pitches.
Data Source
AI summary
A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically connected to the conductive connection portion via the level difference portion on the base body; and a connector electrically connecting the connection terminal and the conductive connection portion, having substantially the same height as a height of the level difference portion.