Connector Housing Recess Structure to Suppress Joint Peeling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing connector configurations face issues with peeling due to thermal shrinkage differences between the connector housing and molded members, leading to reduced waterproofness and potential short circuits.

Innovation Solution

A connector design featuring a recess on the joint surface between the housing and molded portion, which reduces shrinkage and stress during thermal deformation, thereby suppressing peeling and maintaining waterproofness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a molded member is used to seal the joint part between cases or to replace the case, then the size of the entire product is reduced and assembly process steps are simplified, but peeling occurs on the joint surface between the housing and molded portion due to thermal shrinkage difference

Engineering Contradiction:
Improveassembly process stepsVSAvoidwaterproofness
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent applies local quality by providing a recess specifically at the joint surface between the housing and molded portion. This localized structural modification allows the housing to accommodate thermal shrinkage differences without causing peeling, while the rest of the housing maintains its original sealing function. The recess acts as a stress relief zone that prevents crack propagation at the critical joint area.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The recess is designed in advance to cushion the thermal shrinkage stress that will occur during cooling. By providing this preemptive stress relief structure, the patent prevents peeling before it can occur. The recess absorbs the dimensional changes that happen when the molded portion shrinks more than the housing due to different linear expansion coefficients, thereby maintaining the integrity of the joint surface.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Device complexity

If the connector housing and molded member are directly joined without a recess, then the structure is simpler, but thermal shrinkage difference causes peeling and reduces waterproofness

Engineering Contradiction:
Improvejoint surface structureVSAvoidpeeling
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The recess is a localized structural feature provided only at the joint surface between the housing and molded portion. This local modification allows the housing to accommodate thermal shrinkage differences without causing peeling, while the rest of the housing maintains its original sealing function. The recess acts as a stress relief zone that prevents crack propagation at the critical joint area.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The recess is designed in advance to cushion the thermal shrinkage stress that will occur during cooling. By providing this preemptive stress relief structure, the patent prevents peeling before it can occur. The recess absorbs the dimensional changes that happen when the molded portion shrinks more than the housing due to different linear expansion coefficients, thereby maintaining the integrity of the joint surface.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If adhesive or potting resin is used to seal the joint part, then waterproofness is maintained, but the size of the entire product increases and assembly process steps increase

Engineering Contradiction:
ImprovewaterproofnessVSAvoidassembly process steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the sealing function from the adhesive or potting resin and integrates it into the molded portion itself. The molded portion is designed to directly contact and seal against the housing at the joint surface, eliminating the need for separate sealing materials. This integration simplifies the assembly process by removing the steps of applying and curing adhesive or potting resin, while maintaining waterproofness through the precise fit and thermal shrinkage accommodation provided by the recess.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The recessed design effectively suppresses peeling on the joint surface, enhancing waterproofness and preventing short circuits by reducing stress and shrinkage along the joint surface.

Implementation Method 1

there is a thermal shrinkage difference between the connector housing and the molded member. Due to peeling caused by the thermal shrinkage difference

Methodology Applied
Scientific EffectThermal shrinkage: Thermal Contraction

Data Source

PatentUS20240283186A1connector
Publication Date: 2024.08.22 AUTONETWORKS TECH LTD
  • US20240283186A1 patent drawing
  • US20240283186A1 patent drawing
  • US20240283186A1 patent drawing

AI summary

Peeling on a joint surface between a housing and a molded portion can be suppressed. A connector (10) is provided with a terminal fitting (30), a housing (20) including a holding portion (21) for holding the terminal fitting (30) and a receptacle (22) projecting from the holding portion (21), and a molded portion (40) for surrounding the housing (20). In the connector (10), a recess (50) is provided in a joint surface (20A) of the housing (20) with the molded portion (40).