Connector Housing Metal Layer for Thermal Dissipation
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Solution Overview
Problem
Existing electrical plug-in coupling devices face challenges in managing excessive thermal loads generated by electronic components, particularly in applications like charging accumulators, where heat dissipation is crucial to prevent overheating, and they require cost-effective and simple manufacturing processes.
Innovation Solution
The electrical plug-in coupling device features a housing with a plastic part having a pocket and applied metal layers of varying thicknesses, where the electronic component is thermally connected to a thicker metal surface area without air gaps, enhancing heat dissipation through a thermally conductive paste and additional metal layers on both inner and outer surfaces, reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal body is placed in the housing opening to dissipate heat, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent combines the heat dissipation function with the existing housing structure by integrating a metal layer directly into the housing wall. This merging of functions eliminates the need for separate heat dissipation components while maintaining effective thermal management.
Solution Approach 2:
The housing structure is designed to serve multiple functions: it provides mechanical protection, structural support, and heat dissipation. The metal layer integrated into the housing enables the housing to simultaneously act as both a structural component and a thermal management component.
2Adaptability or versatility
If electronic components are integrated into the connector housing, then functionality is improved, but thermal stress increases
Solution Approach 1:
The metal layer acts as an intermediary thermal management component between the electronic components and the housing. It provides a dedicated heat dissipation path that mediates the thermal interaction, allowing electronic components to be integrated while managing the thermal stress through the intermediate metal layer.
3Ease of manufacture
If uniform metal coating is applied to the housing, then manufacturing simplicity is maintained, but heat dissipation efficiency decreases
Solution Approach 1:
The metal layer is applied with varying thickness according to the local heat dissipation requirements. Thicker metal layers are applied in areas requiring greater heat dissipation, while thinner layers are used in areas with lower thermal demands. This local variation optimizes heat dissipation efficiency while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat, minimizing thermal loads on the electronic component and preventing overheating while maintaining a cost-effective and straightforward manufacturing process, ensuring reliable operation in applications like vehicle charging systems.
Implementation Method 1
The first metal layer has a first layer thickness in a first area and a second layer thickness in a second area... The electronic component is arranged in the housing such that it is thermally connected to the second area
Implementation Method 2
The electronic component is thermally connected to the second area, particularly without an air gap... through a thermally conductive paste
Data Source
Figure 1~2
Figure 3~4
AI summary
The invention relates to an electrical connector device comprising a housing (1; 1') and a printed circuit board (2). The housing (1; 1') comprises a plastic part (1.3; 1.3') with a pocket (1.31), wherein the plastic part (1.3; 1.3') has an inner surface and an outer surface. A first metal layer (1.1) is applied to the outer surface. The printed circuit board (2) is equipped with at least one electronic component (2.1) and is arranged in the housing. The first metal layer (1.1) has a first layer thickness (d1) in a first surface area (A1). In a second surface area (A2), which is arranged in the pocket (1.31), it has a second layer thickness (d2), wherein the second layer thickness (d2) is greater than the first layer thickness (d1). The electronic component (2.1) is arranged in the housing (1; 1') such that it is thermally connected to the second surface area (A2) and a straight line (g) with a course orthogonal to the circuit board (2) intersects both the electronic component (2.1) and the second surface area (A2).