Connector Insert Assembly Impedance Matching
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Solution Overview
Problem
Existing connector inserts face challenges in maintaining signal integrity and low insertion loss while ensuring reliable manufacturing and a pleasant physical appearance, especially with high data transfer rates and large volumes of electronic devices.
Innovation Solution
The design includes signal contacts with matched impedance achieved by increasing distance between structures, optimized contact shapes, and features like ground planes and shields to reduce capacitance, along with retention springs and crimping mechanisms for secure cable attachment, ensuring reliable manufacturing and aesthetic appeal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground planes and shields are added to electrically isolate signals, then signal integrity is improved, but capacitance increases and impedance decreases below target value
Solution Approach 1:
The patent applies parameter changes by adjusting the thickness of the ground plane and shield to control capacitance and impedance values. By varying these dimensional parameters, the design achieves both electrical isolation for signal integrity and proper impedance matching near the target value.
Solution Approach 2:
The patent introduces ground planes between rows of contacts and adds a grounded shield surrounding the contacts, adding spatial dimensions to the connector structure. This multi-layer arrangement provides electrical isolation while allowing control over capacitance through dimensional adjustments.
2Manufacturing precision
If thicknesses of shield, ground plane, or contacts are reduced to increase distance, then impedance increases to near target value, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses parameter changes by optimizing the thickness of conductive elements to achieve target impedance values. This approach balances the need for precise impedance matching with practical manufacturing considerations by finding optimal thickness parameters.
Solution Approach 2:
The patent applies partial action by using thin but sufficient ground planes and shields that provide adequate electrical isolation and impedance control without excessive thickness that would complicate manufacturing or increase capacitance beyond desired levels.
3Productivity
If connector inserts are manufactured in high volumes, then productivity increases, but any manufacturing difficulties become significant
Solution Approach 1:
The patent applies segmentation by dividing the connector insert into modular components including contacts, ground planes, and shields that can be manufactured separately and assembled. This modular approach enables high-volume production while maintaining quality control and reducing the impact of manufacturing variations.
Solution Approach 2:
The patent uses parameter changes to optimize manufacturing parameters such as thickness and dimensions of various components, making the manufacturing process more robust and less sensitive to variations, thereby improving reliability in high-volume production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances signal integrity, reduces insertion loss, and improves manufacturability while maintaining a visually appealing design, suitable for high-data-rate applications across various electronic devices.
Implementation Method 1
The ground plane and shield may increase capacitance to the signal contacts, thereby lowering the impedance at the contacts below a target value
Data Source
AI summary
Connector inserts having retention features with good reliability and holding force. These connector inserts may include ground contacts that provide an insertion portion having a reduced length. These connector inserts may be reliable, have an attractive appearance, and be readily manufactured.