Connector With Insert-Molded Substrate and Lead-Free Solder
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Solution Overview
Problem
The existing connectors embedded with substrates face increased manufacturing costs due to complex attaching processes, stress application to substrates, and environmental concerns from lead-based solders, along with potential waterproofing and durability issues.
Innovation Solution
A connector design where the substrate and terminal are insert-molded into a synthetic resin housing, eliminating the need for separate attachment processes, using lead-free solder for environmental safety, and coating the solder junction with liquid curable resin for enhanced reliability and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the substrate is inserted and attached to the housing using a crush rib, then the substrate is fixed in the housing, but a large amount of stress is applied to the substrate during insertion and continuously after attachment
Solution Approach 1:
The substrate fixing rib is integrated directly into the housing body as a unified structure, eliminating the need for separate fixing mechanisms. This merging of the rib structure with the housing allows the substrate to be fixed through the rib's inherent geometry rather than through crushing forces, thereby reducing stress on the substrate while maintaining secure attachment.
2Reliability
If a separate attaching process is used to attach the substrate to the housing, then the substrate can be securely mounted, but the manufacture cost is increased
Solution Approach 1:
The substrate fixing rib is formed as an integral part of the housing during the housing manufacturing process itself, combining the housing formation and substrate fixing structure creation into a single operation. This eliminates the need for separate attaching processes, reducing manufacturing steps and costs while ensuring reliable substrate mounting through the permanently integrated rib structure.
Solution Approach 2:
The fixing rib structure is prepared in advance as part of the housing manufacturing process, before the substrate attachment step. This preliminary formation of the fixing structure eliminates the need for complex real-time attachment operations, simplifying the overall manufacturing process and reducing costs while maintaining mounting reliability.
3Ease of manufacture
If a gap is formed between the housing and the substrate, then the substrate can be easily inserted, but waterproofing ability and durability are deteriorated
Solution Approach 1:
A waterproof film is introduced to seal the gap between the housing and substrate. This thin film barrier maintains the ease of substrate insertion while preventing water penetration through the gap, thereby preserving waterproofing ability without compromising the insertion process.
4Reliability
If lead-based solder is used to mount electronic components on the substrate, then the soldering process is reliable, but environmental protection is compromised
Solution Approach 1:
The solder material composition is changed from lead-based to lead-free, altering the chemical parameters of the solder while maintaining its functional properties. This parameter change eliminates the environmental burden of lead while preserving the reliability of the soldering process through careful selection of lead-free solder alloys with appropriate melting points and bonding characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces manufacturing costs, minimizes stress on substrates, improves waterproofing and durability, and ensures environmental safety by eliminating lead-based solders, while maintaining reliability and corrosion resistance under severe conditions.
Implementation Method 1
the electronic component mounted on the substrate and a solder junction portion between the electronic component and the terminal are coated by a liquid curable resin
Implementation Method 2
coated by a liquid curable resin
Implementation Method 3
the substrate and the terminal are insert-molded in the housing
Data Source
AI summary
To provide a connector embedded with a substrate which can be fabricated with fewer working process at a lower cost.A connector 10 includes a substrate 1 with an electronic component 3 mounted thereon, a terminal 4 which is electrically connected to the substrate 1, and a housing 5 comprised of synthetic resin and attached with the substrate 1 and the terminal 4. In addition, the electronic component 3 and the terminal 4 are electrically connected to the substrate 1 by reflow soldering using a lead-free solder 2. The connector 10 is fabricated by insert-molding the substrate 1 and the terminal 4 in the housing 5. Furthermore, the substrate 1 and the electronic component 3 are embedded in the synthetic resin of the housing 5.