Connector Insert Impedance Control via Shield Thickness
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Solution Overview
Problem
Existing connector inserts face challenges in maintaining high signal integrity and low insertion loss while ensuring a pleasant physical appearance and reliable manufacturing, particularly in high-data-rate applications.
Innovation Solution
The design incorporates ground planes and shields between signal contacts to increase impedance, with optimized contact shapes and manufacturing processes such as stamping, metal-injection molding, and 3-D printing, and features like plastic tips and crimping mechanisms to enhance manufacturability and appearance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground planes and shields are added between signal contacts, then signal integrity is improved, but impedance at contacts decreases
Solution Approach 1:
The patent changes the physical parameters of the ground plane and shield structures by reducing their thicknesses. This parameter modification decreases the capacitance between signal contacts and ground structures, thereby maintaining high impedance while still providing signal isolation and improving signal integrity
Solution Approach 2:
The patent applies different thicknesses to different portions of the ground plane and shield structures. By making the ground plane and shield thinner in specific locations between signal contacts, the patent locally optimizes the capacitance and impedance characteristics to maintain signal integrity without degrading overall performance
2Object-generated harmful factors
If ground plane and shield thicknesses are reduced, then impedance at contacts increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies reduced thicknesses for the ground plane and shield structures as a key parameter change. By reducing these thicknesses, the patent increases the distance between signal contacts and ground structures, thereby increasing impedance and reducing insertion loss while maintaining manufacturability
Solution Approach 2:
The patent applies the thickness reduction selectively to specific portions of the ground plane and shield rather than uniformly across all structures. This partial application of the thickness reduction achieves the necessary impedance increase while maintaining easier manufacturing for the thicker portions
3Reliability
If contact shapes are optimized for maximum distance from ground plane, then signal integrity improves, but device complexity increases
Solution Approach 1:
The patent optimizes the shape of signal contacts locally by contouring them to follow the curvature of the ground plane and shield structures. This local shape optimization ensures maximum distance between the contact and ground structures at critical points, thereby maintaining high impedance and improving signal integrity without requiring complex overall device design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in connector inserts with improved signal integrity, low insertion loss, and a pleasant appearance, while also simplifying the manufacturing process, making them suitable for high-data-rate applications and various electronic devices.
Implementation Method 1
The ground plane and shield may increase capacitance to the signal contacts, thereby lowering the impedance at the contacts
Data Source
AI summary
Connector inserts having contacts with a high-impedance for good signal integrity and low insertion loss, a pleasant physical appearance, and that may be reliably manufactured. One example may provide connector inserts having signal contacts with a high impedance in order to improve signal integrity to allow high data rates. Another may provide connector inserts having a pleasant appearance by providing features to prevent light gaps from occurring between a plastic tip at a front of the connector insert and a connector insert shield. Another may provide reliable manufacturing by crimping a cap used to secure a cable to a connector insert with a multi-section die, where contacting surfaces of the die include various points or peaks along their surface. These points may effectively wrinkle or jog the perimeter of the cap, thereby reducing the dimensions of a cross-section of the cable.