Electrical Connector Shielding via Insulated Protrusions
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Solution Overview
Problem
The existing electrical connectors with metal shielding layers often cause short-circuiting of chip modules due to the metal layer on the protruding blocks coming into contact with the chip module, leading to signal interference issues.
Innovation Solution
An electrical connector design featuring protruding portions with an insulating layer and a metal layer that covers only the upper surface and periphery, preventing direct contact with the chip module, along with a manufacturing method that includes plating and insulating the protruding portions to ensure effective shielding without short-circuiting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the upper surface of the body is plated with a metal layer for shielding, then the shielding effect is improved, but the metal layer on the protruding blocks contacts the chip module causing short-circuiting
Solution Approach 1:
The patent applies local quality by differentiating the treatment of different surfaces: the upper surface receives metal plating for shielding, while the protruding portions are explicitly excluded from plating or covered with insulating material. This localized differentiation allows the body to have shielding capability without causing short-circuits on the chip module contact areas.
Solution Approach 2:
The patent segments the surface treatment into distinct zones: the upper surface is plated with metal for electromagnetic shielding, while the protruding portions are either left unplated or covered with insulating material. This segmentation allows simultaneous achievement of shielding effectiveness and prevention of short-circuiting by treating different functional areas differently.
2Reliability
If the protruding portions are completely covered with insulating material, then short-circuiting is prevented, but the shielding effect is reduced
Solution Approach 1:
The patent applies local quality by selectively covering only the critical contact areas of the protruding portions with insulating material, while leaving other areas exposed or partially covered. This localized insulation prevents short-circuiting at chip module contact points while maintaining shielding effectiveness in other regions through the metal layer.
Solution Approach 2:
The patent segments the protruding portions into insulated and non-insulated zones, where only the areas that contact the chip module are covered with insulating material. This selective segmentation prevents short-circuits without compromising the overall shielding effect, as the metal layer remains exposed in non-critical areas.
3Object-affected harmful factors
If the metal layer is extended to cover the periphery of protruding portions, then shielding is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by designing the protruding portions with specific geometries (such as tapered shapes or defined perimeters) before plating, which naturally guide the metal layer deposition process. This pre-designed geometry simplifies the plating process by providing clear boundaries for metal layer extension to the periphery, reducing manufacturing complexity while achieving improved shielding.
Solution Approach 2:
The patent applies parameter changes by optimizing the geometry of protruding portions (such as angle, height, and perimeter definition) to facilitate uniform metal layer deposition. By carefully controlling these geometric parameters, the metal layer can extend to the periphery of protruding portions with controlled deposition processes, improving shielding without excessively increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields signal interference while preventing short-circuiting by ensuring the metal layer does not contact the chip module, supporting high-frequency signal transmission and maintaining the structural integrity of the connector.
Implementation Method 1
a metal layer covering the upper surface and a periphery of the at least one protruding portion
Implementation Method 2
an insulating portion is located on the at least one protruding portion to support the chip module
Data Source
AI summary
An electrical connector, used for being electrically connected with a chip module, includes a body, at least one protruding portion, a metal layer, and a plurality of terminals. The body is provided with a plurality of accommodating holes, and has an upper surface. The protruding portion protrudes upward from the upper surface, and an insulating portion is located on the protruding portion to support the chip module. The metal layer covers the upper surface and a periphery of the at least one protruding portion, and a portion of the metal layer located on the periphery of the at least one protruding portion is higher than a portion of the metal layer located on the upper surface. The terminals are accommodated in the accommodating holes and used to be conductively connected with the chip module.