High-Speed Connector Isolation Insert for Tight Contact Spacing

Solution Overview

Problem

Existing high speed connectors face challenges in maintaining optimal signal integrity due to inadequate contact pitch, leading to larger connector shells or diminished signal integrity, and the field application of nonconductive spacers is difficult and time-consuming.

Innovation Solution

A thin, nonconductive layer or component is preassembled inside the conductive shell of a high speed connector in the mating area, allowing optimal spacing while preventing high voltage failures, and is manufactured to be assembled during the connector's production rather than in the field.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If contacts are positioned closer together to reduce connector size, then connector volume is reduced, but signal integrity deteriorates

Engineering Contradiction:

Improveconnector volumeVSAvoidsignal integrity

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The nonconductive component is preassembled to the shell during manufacturing before shipping to the customer. This preliminary action ensures proper spacing is established in advance, eliminating the need for field assembly and ensuring optimal signal integrity is achieved without requiring larger connector volume.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If a nonconductive spacer is inserted after contacts are positioned, then signal integrity is improved, but assembly time and complexity increase

Engineering Contradiction:

Improvesignal integrityVSAvoidassembly complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The nonconductive component is integrated with the shell as a preassembled unit, combining what would otherwise be separate assembly steps into a single manufactured component. This merging eliminates the need for separate spacer installation in the field, reducing assembly complexity while maintaining signal integrity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The nonconductive component is preassembled to the shell during manufacturing before shipping to the customer. This preliminary action ensures proper spacing is established in advance, eliminating the need for field assembly and ensuring optimal signal integrity is achieved without requiring larger connector volume.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If a nonconductive spacer is inserted after contacts are positioned, then signal integrity is improved, but assembly time increases

Engineering Contradiction:

Improvesignal integrityVSAvoidassembly time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The nonconductive component is preassembled to the shell during manufacturing before shipping to the customer. This preliminary action ensures proper spacing is established in advance, eliminating the need for field assembly and ensuring optimal signal integrity is achieved without requiring larger connector volume.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12244105B2Isolation component for a tightly packaged high speed connector

Publication Date: 2025.03.04 TE CONNECTIVITY SOLUTIONS GMBH

AI summary

An assembly for terminating a high speed cable. The assembly includes a shell housing having a mating end and a conductor receiving end. A mating portion extends from the mating end. The mating portion has a contact receiving opening with an inside wall which extends circumferentially around the opening. A crosstalk shield is provided in the shell housing. Contacts are positioned in the contact receiving opening of the housing. The contacts terminate high speed conductors of the high speed cable. A nonconductive component is provided on the inside wall in the mating portion of the shell housing. The nonconductive component electrically and physically isolates the contacts from the shell housing.