Electrical Connector Solder Wicking Prevention via Laser Diffusion Area
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Solution Overview
Problem
Conventional electrical connectors experience solder wicking due to the diffusion of solderable metal layers and structural limitations, leading to poor soldering effects and increased production costs.
Innovation Solution
Incorporating a diffusion preventing area formed by laser on the solderable metal layer of the conductive terminal, which separates the soldering portion and main body, preventing solder wicking and allowing precise control of the soldering area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a solder stop portion is extended laterally downward from the bump stopper to prevent solder wicking, then solder wicking is prevented, but the conductive terminal cannot be entered into the containing groove successfully due to structural interference
Solution Approach 1:
The patent divides the containing groove into multiple segments: an upper containing space for the conductive terminal and a lower containing space for the solder. The bump stopper and solder stop portion are segmented as separate structural elements, with the solder stop portion extending only partially to allow terminal insertion while still preventing solder wicking to the contact portion.
Solution Approach 2:
The patent applies different functional qualities to different regions of the containing groove. The upper containing space has a larger cross-sectional area to facilitate terminal insertion, while the lower containing space has a smaller area to contain solder. The sidewall includes a gap that provides local flexibility to accommodate the terminal during insertion while maintaining the solder prevention function.
2Manufacturing precision
If the solderable metal layer is brush-plated at the periphery of the soldering portion, then the soldering area cannot be controlled precisely leading to solder wicking, but reducing the metal layer application area may compromise soldering quality
Solution Approach 1:
The patent extracts the solderable metal layer from the entire periphery of the soldering portion and applies it only to specific predetermined areas. This selective application allows precise control of the soldering area, preventing solder from spreading to unwanted regions while maintaining adequate soldering quality at the intended contact points.
Solution Approach 2:
The solderable metal layer is applied with local quality differentiation - present at specific locations where soldering is desired and absent at locations where solder wicking must be prevented. This localized application strategy achieves both precise area control and maintained soldering reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents solder wicking during the soldering process, reduces production costs by ensuring accurate soldering, and enhances the secure attachment between the solder and the printed circuit board.
Implementation Method 1
at least one diffusion preventing area concavely formed on the base layer and disposed above the solderable metal layer
Implementation Method 2
the solder in the liquid state can be prevented from climbing up towards the base, in other words, preventing the occurrence of a capillary phenomenon
Data Source
AI summary
The invention relates to an electrical connector capable of preventing solder wicking. The electrical connector has an insulating body that includes a plurality of containing grooves and conductives terminals installed in the containing grooves, a solder stop portion extended from a sidewall of the containing groove, the terminal having a main body portion between the solder stop portion and the sidewall, a contact portion extended upwardly from both ends of the main body portion and bent to both sides of the bump stopper and the solder stop portion separately, and a soldering portion extended downwardly from the main body portion and including a diffusion preventing area for separating the main body portion and the soldering portion, and the diffusion preventing area being higher than the lowest point of the solder stop portion.