Connector Locking Protrusion Inclined Surface Gap Adjustment
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Solution Overview
Problem
The existing connection structure of board connectors is inflexible in adjusting the gap between the housing and the printed circuit board, and it is limited to the flow soldering method, often resulting in connection failures due to insufficient solder application during reflow soldering.
Innovation Solution
A connection structure that includes a soldering terminal, a housing body with a stand-off projection, and an elastic locking piece with an inclined contact surface, allowing for adjustable gap settings by varying the diameter of the connector locking opening, enabling both flow and reflow soldering methods without the need for multiple housing configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the stand-off projection portion and wall portions are designed with fixed heights in the housing, then the housing structure is simple and easy to manufacture, but the gap between the housing and printed circuit board cannot be adjusted when different stand-off values are required
Solution Approach 1:
The patent introduces an elastic piece that can be elastically deformed to adjust the stand-off value. The elastic piece includes a pressing portion that presses against the printed circuit board, and by controlling the elastic deformation amount, different stand-off values can be achieved with a single housing structure, eliminating the need for multiple housing configurations.
Solution Approach 2:
The patent changes the physical state of the connection mechanism by using an elastic piece that can be compressed. The elastic piece is pressed in the thickness direction of the printed circuit board, and by controlling the compression amount, the stand-off value can be adjusted. This parameter change approach allows a single housing to achieve multiple gap settings.
2Ease of manufacture
If soldering terminals are inserted through through-holes from above the printed circuit board, then the insertion process is simple, but solder paste charged into the through-holes is extruded and dropped during insertion, resulting in insufficient solder application
Solution Approach 1:
The patent inverts the insertion direction of the soldering terminals. Instead of inserting from above the printed circuit board, the soldering terminals are inserted from below the printed circuit board through the through-holes. This inversion prevents the extrusion and dropping of solder paste during insertion, ensuring sufficient solder application and reliable solder connections.
3Adaptability or versatility
If multiple housing configurations with different stand-off projection heights are prepared to accommodate various gap requirements, then different stand-off values can be achieved, but the device complexity and preparation cost increase significantly
Solution Approach 1:
The patent makes a single housing structure universal by incorporating an elastic piece that can be adjusted to provide different stand-off values. The elastic piece serves multiple functions: it provides the stand-off function, allows adjustment to different gap requirements, and eliminates the need for multiple housing variants. This multi-functionality approach reduces device complexity while maintaining adaptability.
Data Source
Figure 1
Figure 2
Figure 3(a)~3(b)
AI summary
A contact surface (242a) of a locking protrusion (242) is formed into an inclined surface on which a printed circuit board (10) moves away from a substrate connector (20) as the diameter of a connector locking opening (14) increases. The thickness of the printed circuit board (10) is set smaller than the separation distance between the base end (242b) of the contact surface (242a) and a standoff protrusion (23). The diameter of the connector locking opening (14) is set such that the protruding length of a solder terminal (21) from a through-hole (11) matches a desired value.