Connector Shielding With Lossy Inserts To Reduce Crosstalk
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Solution Overview
Problem
Current electrical connectors face challenges in maintaining signal integrity due to increased density and higher signal frequencies, leading to electrical noise from impedance mismatch and cross-talk between signal conductors.
Innovation Solution
The solution involves molding an insulative housing over a frame with signal conductors, forming cavities between them, and inserting electrically lossy materials to reduce crosstalk and impedance mismatch, while using shield members to control signal paths and reduce noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrical connectors are made more dense and operate at higher frequencies to pass more data, then data transmission capacity is improved, but electrical noise from impedance mismatch and cross-talk increases
Solution Approach 1:
The patent applies local quality by making the housing material electrically lossy specifically in the mating contact region where signal conductors are in close proximity. This localized application of lossy material (with conductivity between 10^-6 to 10^3 siemens/meter) targets the specific area where cross-talk and impedance mismatch occur most severely, without making the entire housing conductive. The lossy material is positioned adjacent to signal conductors in the mating contact region to provide localized noise reduction.
Solution Approach 2:
The patent uses electrically lossy material as an intermediary substance between signal conductors in the mating contact region. This intermediary material with controlled conductivity (10^-6 to 10^3 siemens/meter) acts as a mediator that reduces electromagnetic coupling between adjacent signal conductors, thereby reducing cross-talk and impedance mismatch while allowing signal transmission to continue through the connector.
2Reliability
If shield members are added to reduce cross-talk and control impedance, then signal integrity is improved, but device complexity increases
Solution Approach 1:
The patent merges the housing structure with the shielding function by making the housing material itself electrically lossy. Instead of adding separate shield members around each signal conductor or between them, the housing material is formulated with conductive fillers (carbon black, metal particles, metal fibers) to provide the shielding effect directly through the housing structure, thereby reducing cross-talk and controlling impedance without increasing structural complexity.
Solution Approach 2:
The patent uses composite materials by incorporating conductive fillers (such as carbon black, metal particles, or metal fibers) into the insulative housing material to create an electrically lossy material. This composite material has controlled conductivity (10^-6 to 10^3 siemens/meter) that provides shielding and impedance control functions while maintaining the structural integrity of the housing, eliminating the need for additional separate shielding components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves high-frequency performance by minimizing electrical noise and maintaining signal integrity, even at frequencies above 3 GHz, by effectively controlling impedance and crosstalk between signal conductors.
Implementation Method 1
inserting at least one electrically lossy material into the at least one cavity
Implementation Method 2
using shield members to control signal paths and reduce noise
Data Source
AI summary
An electrical connector system includes a daughter card connector formed of a plurality of wafers. Each wafer is formed with cavities between the contacts of the signal conductors. The cavities are shaped to receive lossy inserts whereby crosstalk is reduced. The connector system may also or alternatively include a front housing formed with shield plates also to aid in reducing cross-talk. The front housing is adapted to mate between the wafers of the daughter card connector and a backplane connector of the electrical connector system. In an alternative embodiment, the front housing portion may include lossy conductive portions for cross-talk reduction.