High Density Connector Mating Interface With Shield Plates
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Solution Overview
Problem
Current electrical connectors face challenges in maintaining signal integrity at high frequencies while achieving high density, as they often experience electrical interference and manufacturing tolerances become tighter with increasing connector size, leading to increased manufacturing costs.
Innovation Solution
The design incorporates a mating interface with conductive elements formed into three-dimensional structures, featuring tabs and torsional beam contacts to ensure reliable contact and reduce crosstalk, along with a shield plate positioned between signal conductors to manage impedance and prevent interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of signal conductors is increased to achieve high density, then the data transmission capacity is improved, but electrical interference and crosstalk between adjacent conductors increases
Solution Approach 1:
A shield plate is introduced as an intermediary component positioned between adjacent signal conductors. The shield plate acts as a mediator that blocks electromagnetic fields from one conductor from interfering with adjacent conductors, thereby reducing crosstalk while allowing high-density conductor arrangement for increased data transmission capacity.
Solution Approach 2:
The connector is divided into modular sections with shield plates positioned between groups of conductors. This segmentation creates isolated electromagnetic zones, allowing each group of conductors to operate independently without interfering with adjacent groups, thus enabling higher density arrangements.
2Reliability
If shield members are added between signal conductors to reduce interference, then signal integrity is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The shield plate is merged with the insulator as a single integrated component rather than being a separate part. This combining of functions reduces the total number of components, simplifies assembly, and lowers manufacturing complexity while still providing the necessary shielding for signal integrity.
Solution Approach 2:
The shield plate serves multiple functions simultaneously: it provides electromagnetic shielding between conductors, acts as a structural support element, and contributes to the overall mechanical integrity of the connector. This multi-functionality reduces the need for additional specialized components.
3Productivity
If connector size is increased to accommodate more conductors, then high density is achieved, but manufacturing tolerances become tighter and costs increase
Solution Approach 1:
The high-density conductor array is segmented into smaller groups separated by shield plates. Each segment can be manufactured and positioned independently with relaxed tolerances, avoiding the need for tight tolerances across the entire large connector structure. This modular segmentation enables high overall density while maintaining manufacturability.
Data Source
AI summary
Mating interfaces for an electrical connector are provided. In some embodiments, a mating interface comprises: a plurality of conductive elements positioned in a plurality of columns, each of the plurality of conductive elements comprising: a sheet of conductive material formed into a three dimensional structure such that the conductive material is disposed on at least two sides of an opening adapted to receive a mating conductive element; and at least one tab cut in the sheet, the at least one tab comprising a mating contact surface facing the opening and adapted to make contact to the mating conductive element.