Connector Metal Plate Gap Prevents Pin Conduction

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Solution Overview

Problem

Portable electronic device connectors can malfunction or cause user injury due to unexpected conduction between the metal enhancing plate and the power pin, often resulting from external conductive substances accumulating and causing heat generation.

Innovation Solution

The connector design includes an insulating base with a specific alignment of pins and a metal enhancing plate that does not extend to the side surface corresponding to the power pin, along with strategically positioned through holes that are misaligned with the power pin's edges, preventing conductive substances from causing unintended conduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the metal enhancing plate extends to the side surface of the insulating base, then the structural strength and shielding effect are improved, but the risk of unexpected conduction with the power pin increases

Engineering Contradiction:
Improvestructural strengthVSAvoidconduction safety
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The metal enhancing plate is extracted from extending to the side surface of the insulating base, creating a deliberate gap between the plate and the side surface. This extraction eliminates the conduction pathway while preserving the plate's shielding function on the second surface, resolving the contradiction between structural strength and conduction safety.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The insulating base is designed with differentiated local properties: the first through holes are positioned to align with signal pins for structural purposes, while the side surface is specifically designed without metal plate extension near the power pin. This local quality differentiation allows the metal enhancing plate to provide shielding where needed while maintaining safety gaps where conduction risks exist.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the first through hole is aligned with the power pin, then the manufacturing precision is simplified, but the risk of conductive substance accumulation increases

Engineering Contradiction:
Improvealignment precisionVSAvoidconductive substance accumulation
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The first through hole is deliberately positioned asymmetrically relative to the power pin, specifically avoiding alignment with the power pin's side edges. This asymmetric positioning prevents conductive substances from traveling along the through hole to reach the power pin, while still maintaining adequate manufacturing precision through defined spatial relationships.

Inventive Principle:
Principle #4Asymmetry

3Device complexity

If the connector uses a simple insulating base design, then the device complexity is reduced, but the ability to prevent unexpected conduction is weakened

Engineering Contradiction:
Improveconnector structureVSAvoidconduction prevention
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The insulating base is designed to perform multiple functions simultaneously: it provides structural support for the pins, creates isolation gaps between the metal enhancing plate and power pin, positions the first through holes to prevent conductive substance pathways, and maintains overall connector geometry. This multi-functionality prevents unexpected conduction without significantly increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20170104301A1connector
Publication Date: 2017.04.13 HTC CORP
  • US20170104301A1 patent drawing
  • US20170104301A1 patent drawing
  • US20170104301A1 patent drawing

AI summary

A connector includes an insulating base, a plurality of pins and a metal enhancing plate. The insulating base has a first surface, a second surface and a side surface, wherein the first surface is opposite to the second surface, and the side surface is connected between the first surface and the second surface. The pins are disposed on the first surface and include a power pin, wherein a section of the side surface is aligned with the power pin. The metal enhancing plate is disposed on the second surface, wherein the metal enhancing plate does not extend to the section of the side surface.