Connector Module With Non-Conductive Base Layer

The patent introduces a non-conductive barrier layer as an intermediary between the conductive base and the electrical terminals. This barrier layer is integrated into the base structure itself, serving as a mediator that prevents electrical contact between the conductive base and terminals without requiring separate overmolding of each terminal. The barrier layer is formed simultaneously with the base through a single molding process, eliminating the need for subsequent terminal separation operations.

The patent performs preliminary action by pre-forming the non-conductive barrier layer as an integral part of the base structure before the electrical terminals are installed. The barrier layer is created during the base molding process itself, with flow passages designed to allow proper plastic flow at normal processing conditions. This preliminary formation of the barrier structure eliminates the need for high-pressure overmolding operations that would otherwise be required to force plastic through narrow passages, thereby preventing plastic degradation and shrinkage.

The patent inverts the conventional approach by not overmolding the terminals at all. Instead, the non-conductive barrier layer is formed as part of the base structure, with openings or windows that allow the electrical terminals to extend through. This inverted approach eliminates the need to separate terminals after overmolding, as the terminals remain in their original lead frame configuration and are simply positioned through the pre-formed barrier layer during assembly.