Connector Module Heat-Dissipation Element Design
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Solution Overview
Problem
Conventional connector modules have poor heat dissipation efficiency, which adversely affects data transmission rates due to reliance on convection for heat dissipation.
Innovation Solution
A connector module design incorporating a heat-dissipation element with a heat-absorption section, a heat-transfer section, and a heat-dissipation section, where the heat-absorption section is in direct contact with a plug device, and the heat-transfer and dissipation sections facilitate heat transfer and convection through strategically placed slots and outlets, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional connector modules rely on convection for heat dissipation, then the structure is simple, but the heat dissipation efficiency is poor and data transmission rate is adversely affected
Solution Approach 1:
The heat dissipation element is divided into three distinct sections: heat-absorption section (contacting the plug device), heat-transfer section (extending through slots), and heat-dissipation section (exposed outside). This segmentation allows each part to perform its specific function optimally, improving overall heat dissipation efficiency while maintaining a manageable structural complexity
Solution Approach 2:
The heat-dissipation element acts as an intermediary between the plug device (heat source) and the ambient air (heat sink). It absorbs heat from the plug device, transfers it through its structure via conduction, and dissipates it to the environment through convection, thereby mediating the heat transfer process and improving heat dissipation efficiency
2Productivity
If heat dissipation efficiency is improved by adding heat-dissipation element, then data transmission rate is maintained, but the device complexity increases
Solution Approach 1:
The heat-dissipation element performs multiple functions: it serves as a heat sink, a structural support component, and a thermal conduction path. By integrating these functions into a single element, the patent improves heat dissipation efficiency and maintains data transmission rate without proportionally increasing device complexity
Solution Approach 2:
The heat-dissipation element is strategically positioned with its heat-absorbing surface at specific locations (corresponding to the bottom opening of the supporting rack and above the top inner wall surface of the lower slot way) to directly contact the plug device where heat is generated. This localized heat absorption approach improves heat dissipation efficiency at the critical heat generation points while maintaining overall structural simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved heat dissipation efficiency ensures better data transmission rates by effectively transferring and dissipating waste heat from the connector module and plug devices into the ambient air through enhanced convection and heat transfer mechanisms.
Implementation Method 1
the heat-absorbing surface is located corresponding to the bottom opening of the supporting rack and above a top inner wall surface of the lower slot way in the case for directly contacting with a plug device that is plugged into the lower slot way
Implementation Method 2
the heat-transfer section is extended through a space between the two top-and-bottom spaced slots of the base and through the case, such that the heat-dissipation section is exposed from the case
Implementation Method 3
the heat-dissipation efficiency and data transmission rate... waste heat from the connector module and plug devices into the ambient air through enhanced convection and heat transfer mechanisms
Data Source
AI summary
A connector module includes a connector module main body having a base and a case, and a heat-dissipation element. The base has an external connection surface and two top-and-bottom spaced slots located above the external connection surface. The case internally defines an upper and a lower slot way separated from each other by a supporting rack, which has a bottom opening. The base is fitted in the case with the external connection surface downward exposed from the case and the two slots communicating with the upper and lower slot ways. The heat-dissipation element is mounted in the connector module main body in a front-rear direction with a heat-absorbing surface located corresponding to the bottom opening of the supporting rack and above the lower slot way for contacting with a plug device in the lower slot way to ensure good heat-dissipation efficiency and data transmission rate of the connector module.