Connector Module Heat Dissipation via Segmented Insulative Housing
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Solution Overview
Problem
Existing heat dissipation structures for connector modules face challenges in efficiently dissipating heat generated by high-current applications, leading to insufficient heat dissipation performance and a high risk of control board damage or short circuits, especially when the module is designed for large current paths.
Innovation Solution
A heat dissipation structure for connector modules that incorporates first and second bus bars formed by metal plates, a control board with electronic components, and a case member made of insulative resin, where the semiconductor elements are housed and partially exposed, along with signal input terminals, to manage heat dissipation and reduce the risk of damage or short circuits. The structure includes a metal module fixing part with a larger surface area for heat dissipation and uses a heat radiation fin for enhanced cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is released from the metal case housing the control board, then heat dissipation is improved, but heat dissipation performance is insufficient when large current flows
Solution Approach 1:
The patent divides the housing into two distinct parts: an insulative housing for the control board and a separate metal case for heat dissipation. This segmentation allows the control board to be protected from direct heat exposure while still enabling effective heat dissipation through the metal case's thermal conductivity and larger surface area.
Solution Approach 2:
The patent introduces an insulative housing as an intermediary between the heat-generating electronic components and the metal case. This intermediary protects the control board from direct contact with the metal case while allowing heat to be transferred to the metal case for dissipation, thus mediating between thermal management requirements and electrical insulation needs.
2Ease of manufacture
If the control board is assembled in the metal case in a sliding manner, then assembly is simplified, but the control board is likely damaged
Solution Approach 1:
The patent separates the control board housing from the metal case, creating two independent components. The control board is mounted in the insulative housing rather than sliding into the metal case, eliminating mechanical damage risks while maintaining assembly simplicity through the separate housing structure.
Solution Approach 2:
The insulative housing serves as a protective intermediary between the control board and the metal case. This intermediary housing provides mechanical protection and electrical insulation, allowing the control board to be assembled safely without direct contact with the metal case that could cause damage during sliding assembly.
3Device complexity
If the control board is directly attached to the metal case, then structure is simplified, but probability of short circuit is high
Solution Approach 1:
The patent divides the structural system into two separate housings: an insulative housing for the control board and a metal case for heat dissipation. This segmentation physically isolates the control board from the conductive metal case, eliminating short circuit risks while maintaining relatively simple overall structure through modular design.
Solution Approach 2:
The insulative housing acts as an intermediary barrier between the control board and the metal case. This intermediary material provides electrical insulation that prevents short circuits while allowing the structure to remain relatively simple through the use of a single-piece insulative housing rather than complex insulation layers.
4Power
If the module is designed for large current paths, then power handling is improved, but heat dissipation becomes insufficient
Solution Approach 1:
The patent separates the power handling function (metal case for heat dissipation) from the control function (insulative housing for control board). This segmentation allows the metal case to be optimized for thermal management with high thermal conductivity and large surface area, while the insulative housing protects the control board, enabling the module to handle large currents effectively.
Solution Approach 2:
The insulative housing serves as a mediator that allows the metal case to be optimized for heat dissipation without compromising control board safety. This intermediary structure enables the power handling and heat dissipation capabilities to be maximized through the metal case while the control board remains protected, solving the heat dissipation insufficiency problem in high-power applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation performance, reduces the risk of control board damage and short circuits, and allows for miniaturization of the connector module while maintaining effective heat management for high-current applications.
Implementation Method 1
a heat dissipation part Hp which is formed by exposing a part of the electronic component 11c from the case member 120 or formed by a wall 120u, 120d of the case member 120 which is in contact with the electronic component 11c, and the heat dissipation part Hp contacts an inner wall iw of the module fixing part 6 directly or via a heat conductive member
Implementation Method 2
a metal member 5 which has a surface area larger than a surface area of the connector module 101
Implementation Method 3
as heat generated from the electronic components can be released to the ambient air via the projection of the metal case
Data Source
AI summary
A connector module is provided with first and second bus bars which are respectively formed by a metal plate, a control board on which an electronic component is mounted, and case member which is formed by insulative resin and houses the control board therein. Connector parts to be connected with respective counterpart connectors are integrally formed with the case member.