Connector With Built-In Module Heat Propagation Means
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Solution Overview
Problem
Optical connectors with integrated electrical components face challenges in efficiently and reliably cooling these components, leading to potential thermal management issues and interference with optical components during assembly.
Innovation Solution
A connector design incorporating a heat propagation means within its metal main body case, which efficiently disperses heat generated by electrical components to the exterior, where it can be cooled by circulated air, while maintaining a minimal gap to prevent optical interference and ensure reliable signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electrical components are integrated into the connector body, then functionality is improved, but heat generation causes thermal management issues
Solution Approach 1:
The patent extracts the heat generation problem from the electrical component itself and transfers it to a dedicated heat propagation means (heat dissipation structure). This separate structure is designed specifically to conduct heat away from the electrical component to the connector exterior, where it can be dissipated more effectively.
Solution Approach 2:
The heat propagation means acts as an intermediary between the electrical component and the connector exterior. It provides a dedicated thermal pathway that mediates the heat transfer process, allowing efficient heat removal without requiring direct contact between the electrical component and the outer casing.
2Temperature
If cooling structures are added to the connector, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat propagation means is integrated into the connector body structure itself, merging the cooling function with the structural framework. This eliminates the need for separate, complex cooling systems while still providing effective heat dissipation through the connector exterior.
Solution Approach 2:
The connector body serves multiple functions: it provides structural support, houses the optical and electrical components, and simultaneously acts as a heat dissipation pathway through the heat propagation means. This multi-functionality reduces the need for additional dedicated cooling components.
3Adaptability or versatility
If the connector is designed for small sockets, then adaptability is improved, but space for heat dissipation is reduced
Solution Approach 1:
The heat propagation means is strategically positioned and configured to provide localized heat dissipation pathways within the compact connector body. The structure creates specific thermal conduction channels that efficiently transport heat from the electrical component to the connector exterior, maximizing heat dissipation effectiveness within the limited space.
4Ease of manufacture
If optical components are positioned close to electrical components, then assembly is simplified, but optical interference may occur
Solution Approach 1:
The patent extracts the heat and potential interference from the electrical component vicinity by introducing a dedicated heat propagation means that creates a thermal and potentially electromagnetic separation. This allows the optical and electrical components to be positioned close together for assembly simplicity while preventing harmful interactions through the intermediary heat dissipation structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools electrical components, enhances cooling efficiency, and prevents optical characteristic deterioration, allowing for comfortable adaptation to small sockets and maintaining reliable optical communication.
Implementation Method 1
a heat propagation means, of which at least a portion is disposed at the first portion, and which propagates heat generated by the electrical component to the first portion
Implementation Method 2
the cooling air comes into contact with the first portion inside the external case. Accordingly, heat from the electrical component may be efficiently dispersed in the device, and the electrical component may be efficiently and reliably cooled
Data Source
AI summary
A connector incorporating a module, in which an incorporated electrical component may be cooled efficiently and reliably, is provided. A transmission apparatus disposed inside a main body cover of a module-incorporating connector is provided with a ceramic board at which an electrical component and such are mounted. A metal cover touches an upper face of the electrical component. A portion of the metal cover is disposed in an insertion portion of the main body cover. Heat generated by the electrical component is propagated via the metal cover to the insertion portion of a first cover member. When the module-incorporating connector is connected to a socket of a device, the insertion portion is disposed inside an exterior case, in which temperature is controlled by an air conditioner, and cooling is performed reliably and efficiently.