Connector Mounting on Flexible Circuit Board Using Reinforcement Plate
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Solution Overview
Problem
Conventional flexible circuit boards face challenges in maintaining a stable and strong connection with connectors, especially in applications requiring frequent removals and insertions, and they often fail to control impedance effectively for high-frequency differential mode signals, leading to signal distortion.
Innovation Solution
A mounting structure that incorporates a reinforcement plate coupled to the flexible circuit board, using SMD pins and solder-dipping pins with corresponding soldering zones and holes, along with a conductive adhesive layer to enhance mechanical strength and electrical connectivity, allowing for easy assembly and improved impedance control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If only SMD pins are used to fix the connector to the flexible circuit board, then the assembly process is simple, but the connection stability and mechanical strength are insufficient for frequent removals and insertions
Solution Approach 1:
The patent combines two fixing methods: SMD pins soldered to SMD soldering zones and solder-dipping pins passing through through-holes with solder-dipping. This hybrid approach merges the simplicity of SMD assembly with the mechanical strength of through-hole mounting, resolving the contradiction between ease of assembly and connection stability.
Solution Approach 2:
The patent uses a composite fixing structure combining solder joints from both SMD and through-hole methods, creating a hybrid connection system that leverages the advantages of both techniques to achieve both ease of assembly and high reliability.
2Reliability
If a reinforcement plate is added to enhance connection stability, then the mechanical strength improves, but the device complexity increases
Solution Approach 1:
The reinforcement plate is segmented with through-holes positioned at specific locations to accommodate solder-dipping pins. This segmentation allows the plate to provide structural support while maintaining ease of assembly and minimizing unnecessary complexity.
Solution Approach 2:
The reinforcement plate is strategically placed only at the connector mounting section of the flexible circuit board, providing local reinforcement where needed rather than throughout the entire board, thus minimizing overall complexity while maximizing connection stability.
3Adaptability or versatility
If the flexible circuit board is made bendable for flexible manipulation, then the adaptability improves, but the impedance control for high-frequency signals deteriorates
Solution Approach 1:
The reinforcement plate is applied locally at the connector mounting section where impedance control is critical for high-frequency signals. This localized reinforcement maintains impedance stability in the signal transmission area while preserving the overall flexibility of the circuit board for bendable applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a stable and strong connection between the connector and the flexible circuit board, capable of withstanding frequent insertions and manipulations, while also effectively managing impedance for reliable high-frequency signal transmission.
Implementation Method 1
The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered by a solder material.
Data Source
AI summary
Disclosed is a soldering structure for mounting at least one connector on a flexible circuit board. The connector includes SMD pins and solder-dipping pins. The flexible circuit board has a connector mounting section having a component surface on which SMD soldering zones and solder-dipping pin holes are formed. A reinforcement plate is coupled to a reinforcement bonding surface of the flexible circuit board. The reinforcement plate has through holes corresponding to the solder-dipping pin holes of the flexible circuit board. The SMD pins of the connector are respectively soldered to the SMD soldering zones of the flexible circuit board, and the solder-dipping pins of the connector are respectively inserted through the solder-dipping pin holes of the flexible circuit board and the through holes of the reinforcement plate to the soldering surface of the reinforcement plate to be soldered with a solder material.