Connector Thermal Conduction via Movable Contact Segmentation

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Solution Overview

Problem

Existing connectors for card-type devices face challenges in efficiently conducting heat generated in the devices to a substrate without obstructing the opening-closing operation of the cover, as the contact portions between the cover and housing can interfere with the operation.

Innovation Solution

A connector design featuring a housing with multiple contact rows and a resilient frame structure that allows thermal conduction paths to form between the cover and housing only when the cover is shifted from a closed to a locked state, preventing interference with the opening-closing operation and ensuring heat dissipation even if individual contact points fail.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the number of contact portions between the cover and housing is increased to improve heat conduction efficiency, then heat dissipation performance is improved, but the opening-closing operation of the cover is obstructed

Engineering Contradiction:

Improveheat conduction efficiencyVSAvoidopening-closing operation

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The contact portions are designed to be movable rather than fixed, allowing them to dynamically change their contact state with the cover based on the cover's position. During opening-closing operation, the contact portions retract or maintain distance to avoid obstruction, while in the locked state they extend to establish thermal conduction paths, thus resolving the contradiction between operational ease and heat conduction efficiency

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The thermal conduction function is segmented from the cover structure itself and transferred to separate contact portions on the housing. This segmentation allows the contact portions to be independently controlled and positioned, enabling them to form thermal conduction paths only when needed (in locked state) without interfering with the cover's opening-closing movement

Inventive Principle:

Principle #1Segmentation

2Temperature

If contact portions are positioned to ensure thermal conduction, then heat dissipation is improved, but reliability decreases due to potential contact failures

Engineering Contradiction:

Improveheat dissipationVSAvoidcontact reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The housing is designed with multiple contact portions distributed at different locations, each providing a localized thermal conduction path. This distribution of contact functions to multiple locations ensures that if one contact portion fails, other contact portions can still maintain thermal conduction, thereby improving overall system reliability while maintaining effective heat dissipation

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The design anticipates potential contact failures by providing redundant contact portions before failures occur. The multiple contact portions are positioned such that the failure of individual contacts does not compromise the overall thermal conduction function, as other contact portions can compensate and maintain the thermal path from cover to substrate

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The connector effectively conducts heat from the card-type device to the substrate without hindering the cover's opening-closing operation and maintains thermal conduction efficiency by distributing heat across a single-piece metal frame, minimizing the impact of potential contact failures.

Implementation Method 1

the support spring portions have resilience and are located between the first contact portions and the second contact portions in the front-rear direction... brought into contact with the cover upon shifting the cover from a closed state into a locked state

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

maintains thermal conduction efficiency by distributing heat across a single-piece metal frame

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10622738B2Connector

Publication Date: 2020.04.14 JAPAN AVIATION ELECTRONICS IND LTD

AI summary

A cover of a connector has axis portions and first and second cover contact points. A housing has axis receiving portions and first through third contact portions. The axis portions are received by the axis receiving portions, and the cover is attached to the housing to be placed at any one of an open position, a closed position and a locked position. The first contact portions are exposed in the axis receiving portions. When the cover is placed at the locked position, the axis portions are face the first contact portions from beneath, and the second cover contact points are face the second contact portions from beneath. When the cover is placed at the closed position, the first cover contact points do not touch the third contact portions. When the cover is placed at the locked position, the first cover contact points touch the third contact portions.