Electrical Connector Odd-Tier Contact Portion Allocation
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Solution Overview
Problem
Electrical connectors with an odd number of contact tiers face challenges in miniaturization due to uneven terminal portion allocation, leading to increased size and instability when connecting to a printed circuit board, causing potential positional deviations and stress during mounting and soldering.
Innovation Solution
The electrical connector arranges contact portions in an odd number of tiers with terminal portions allocated in a balanced manner between two terminal tiers, using a specific configuration where terminal portions from different tiers are alternately allocated to maintain balanced occupancy and stability, and incorporates elasticity to securely hold the printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If terminal portions are allocated to only one terminal portion tier when contact portions are arranged in an odd number of tiers, then the structure is simplified, but the occupation space increases and miniaturization becomes difficult
Solution Approach 1:
The patent divides the terminal portions into two separate terminal portion tiers (first and second terminal portion tiers) even when contact portions are arranged in an odd number of tiers. This segmentation allows for more balanced spatial distribution of terminal portions, reducing the overall occupation space of the electrical connector while maintaining structural simplicity.
2Device complexity
If terminal portions are allocated to only one terminal portion tier, then the allocation process is simplified, but the electrical connector becomes unstable during mounting and soldering
Solution Approach 1:
By segmenting terminal portions into two tiers, the patent creates a more balanced and stable configuration during mounting and soldering operations, preventing inclination and positional deviation while keeping the allocation process manageable.
Solution Approach 2:
The patent employs asymmetric allocation of terminal portions from the middle contact portion tier to the two terminal portion tiers, creating a balanced configuration that enhances stability during mounting and soldering while accommodating the odd number of contact tiers.
3Ease of manufacture
If terminal portions are unevenly allocated to terminal portion tiers, then the structure is simpler to manufacture, but unwanted stress is applied to soldered portions after mounting
Solution Approach 1:
The segmentation of terminal portions into two tiers allows for more uniform stress distribution across the soldered connections, reducing unwanted stress on individual solder joints while maintaining ease of manufacture through systematic arrangement.
Solution Approach 2:
The patent applies local quality by strategically allocating terminal portions from the middle contact tier to different terminal tiers based on their spatial and functional requirements, optimizing stress distribution while maintaining manufacturing simplicity.
Data Source
AI summary
The terminal portions 222a, 222b of the contacts having the contact portions 221a, 221b belonging to (2n/2)-th contact portion tier 2-21 are arranged so as to be alternately allocated to the first terminal portion tier 1-22 and the second terminal portion tier 2-22.