Connector Partition Sections for Photoelectric Chip Heat Dissipation
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Solution Overview
Problem
Existing electrical connectors for photoelectric conversion suffer from inadequate heat dissipation, leading to increased thermal contact resistance and reduced performance when only one plug is inserted, as the heat conduction pad lacks sufficient surface contact with the protection case.
Innovation Solution
The connector design includes a cage with partition sections and a heat conduction apparatus that penetrates through the partition sections, forming a heat conduction path and using heat conduction pads with metal particles for improved conductivity, and heat dissipation devices on the sidewalls to efficiently transfer heat away from the photoelectric chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat conduction pad is used between the photoelectric chip and protection case, then heat dissipation is improved, but thermal contact resistance increases when only one plug is inserted due to insufficient surface contact
Solution Approach 1:
The heat conduction pad is constructed as a composite material structure combining metal particles (such as aluminum or copper) embedded in a polymer matrix. This composite structure provides both mechanical compliance to ensure adequate contact pressure and thermal conductivity to effectively transfer heat from the photoelectric chip to the protection case, thereby reducing thermal contact resistance while maintaining improved heat dissipation performance
Solution Approach 2:
The invention changes the physical and chemical parameters of the heat conduction pad by incorporating metal particles with high thermal conductivity into the polymer matrix. This parameter modification enhances the thermal conductivity of the pad material itself, compensating for the reduced contact area when only one plug is inserted, and maintains effective heat transfer performance across varying operational conditions
2Reliability
If two plugs are inserted to provide sufficient contact force, then thermal contact resistance is reduced, but the device complexity and space requirements increase
Solution Approach 1:
The invention extracts the function of providing sufficient contact force from the requirement of inserting two plugs and transfers it to the heat conduction pad's inherent material properties. The metal particle composite structure provides adequate thermal contact through its material characteristics rather than requiring dual plug insertion, thereby simplifying the device configuration while maintaining reliable thermal contact
Solution Approach 2:
The heat conduction pad acts as an intermediary element that mediates between the photoelectric chip and protection case. By using a compliant composite material, it ensures adequate thermal contact without requiring the mechanical pressure that would result from inserting two plugs, thus resolving the contradiction between contact reliability and device simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces the temperature of the photoelectric chip by up to 40°C, enhancing the heat dissipation efficiency and maintaining performance even when only one plug is inserted, by increasing the contact area and reducing thermal resistance.
Implementation Method 1
a heat conduction apparatus (4) configured to pass through the plurality of partition sections (3) along a width of the cage (1)... form a heat conduction path... dissipate the heat generated by the photoelectric chip
Data Source
AI summary
A connector for receiving a plurality of plugs is provided. The connector includes a cage, a plurality of partition plates, a plurality of partition sections, and a heat conduction apparatus. The cage includes a plurality of plug receiving passageways arranged along two rows stacked on top of each other. Each of the plurality of partition plates is positioned between two laterally adjacent plug receiving passageways of the plurality of plug receiving passageways, while each of the plurality of partition sections is positioned between two adjacent plug receiving passageways of the plurality of plug receiving passageways. The heat conduction apparatus penetrates through the plurality of partition sections along a width thereof.