Uneven Connector Interface in Passivation Layer
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Solution Overview
Problem
Conventional semiconductor manufacturing techniques often result in bonding pads being pulled out of the substrate during the wire bonding process, leading to reduced yield due to insufficient structural stability and adhesion.
Innovation Solution
Embedding connectors within a passivation layer formed using 3D printing technology, with an uneven interface to enhance structural stability and adhesion, preventing the connectors from being pulled out during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding pads are used in conventional semiconductor manufacturing, then electrical connections can be established, but the bonding pads are pulled out of the substrate during wire bonding process due to insufficient structural stability
Solution Approach 1:
The connector features an uneven interface with curved or non-planar contact surfaces that mate with corresponding uneven structures in the passivation layer. This curved interface design increases the contact area and mechanical interlocking between the connector and passivation layer, preventing the connector from being pulled out during wire bonding while maintaining reliable electrical connections.
Solution Approach 2:
The connector is embedded within the passivation layer, creating a nested structure where the connector resides inside a cavity or recess formed in the passivation layer. This nesting approach provides mechanical support and anchoring for the connector, enhancing its structural stability and resistance to pull-out forces during bonding operations.
2Reliability
If conventional planar interfaces are used between connectors and passivation layer, then manufacturing is simpler, but adhesion is insufficient leading to connector displacement
Solution Approach 1:
The interface between the connector and passivation layer is designed with non-uniform local characteristics, including varying depths, angles, and surface textures in different regions. This local variation in interface geometry creates enhanced mechanical interlocking at critical stress points while maintaining overall manufacturing feasibility through selective area treatment or targeted structuring.
Solution Approach 2:
The connector interface and corresponding passivation layer structure employ asymmetric geometries rather than symmetric planar surfaces. The uneven distribution of contact areas, varying wall angles, and non-uniform interface profiles create directional mechanical interlocking that resists pull-out forces more effectively than symmetric planar interfaces, while the asymmetry can be efficiently achieved through modern fabrication techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The uneven interface between the connectors and the passivation layer improves adhesion and structural stability, increasing the yield of semiconductor devices by preventing connector displacement during bonding processes.
Implementation Method 1
forming a passivation layer on the substrate by a first 3D printing technology
Implementation Method 2
forming a connector in the opening by a second 3D printing technology
Implementation Method 3
the interface of the connector in contact with the passivation layer is uneven... the adhesion between the connector and the substrate is enhanced
Data Source
AI summary
Provided is a semiconductor device including a substrate, a passivation layer, and a connector. The passivation layer is disposed on the substrate. The connector is embedded in the passivation. An interface of the connector in contact with the passivation layer is uneven, thereby improving the structural stability of the connector. A method of manufacturing the semiconductor is also provided.