Connector Pin Segmentation for Noise Reduction
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Solution Overview
Problem
Electronic devices with wireless communication units face reduced communication speeds due to electromagnetic noise radiation from cables, which is not adequately addressed by existing noise reduction methods, especially with the miniaturization of devices and increased sensitivity of communication units, and can interfere with other electronic devices performing wireless communication.
Innovation Solution
A communication module design featuring a wiring board with ground wiring, electronic components, and connectors where high-frequency signal pins are arranged without non-high-frequency signal pins between them, and ground terminals are strategically placed to minimize phase differences between signal and return currents, reducing electromagnetic noise radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional noise reduction methods (such as ring-shaped ferrite core) are used to reduce electromagnetic noise radiation from cables, then some noise reduction effect is achieved, but the noise reduction is insufficient due to miniaturization of electronic devices and increased sensitivity of wireless communication units
Solution Approach 1:
The connector pins are segmented into distinct groups: high-frequency signal pins (first pins) and non-high-frequency signal pins (other pins). By spatially separating these pin groups and positioning the high-frequency pins adjacent to the ground terminal without intervening pins, the patent creates isolated electromagnetic zones that reduce noise radiation. This segmentation approach divides the connector's electromagnetic environment into controlled regions, effectively reducing the harmful electromagnetic noise while maintaining reliable wireless communication.
2Volume of moving object
If electronic devices are miniaturized to reduce size, then device compactness is improved, but electromagnetic noise radiation increases and interferes with wireless communication
Solution Approach 1:
The patent applies local quality by creating a specific arrangement pattern within the connector where high-frequency signal pins are positioned in direct adjacency to the ground terminal. This localized configuration optimizes the electromagnetic field distribution at the critical connection point, reducing noise radiation from that specific region. The selective positioning of pins based on their signal frequency requirements creates locally optimized electromagnetic environments without requiring overall device enlargement.
3Measurement precision
If sensitivity of wireless communication unit is increased to improve communication performance, then communication quality is improved, but the unit becomes more susceptible to electromagnetic noise radiation
Solution Approach 1:
The patent implements preliminary anti-action by designing the connector pin arrangement to preemptively counteract electromagnetic noise before it can interfere with the wireless communication unit. By positioning high-frequency signal pins adjacent to the ground terminal and eliminating intervening pins, the design creates an electromagnetic shield effect at the source of potential noise generation. This preliminary structural arrangement prevents noise from propagating to the sensitive wireless communication unit, allowing high sensitivity without corresponding noise susceptibility.
Data Source
AI summary
A communication module includes a wiring board including ground wiring, an electronic component provided on the wiring board, and a first connector provided on the wiring board and electrically connected to the electronic component via the wiring board. The first connector includes a metal member electrically connected to the ground wiring, and a plurality of pins arranged in an arrangement direction and including a plurality of high-frequency signal pins used for transmission of a high-frequency signal and a plurality of non-high-frequency signal pins for a use different from the transmission of the high-frequency signal. The plurality of high-frequency signal pins include a plurality of first pins successively arranged in the arrangement direction. None of the plurality of non-high-frequency signal pins is interposed between the plurality of first pins and the metal member.


