Electrical Connector Signal Ground Contact Plating Cost Reduction

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Solution Overview

Problem

The high cost of plating electrical connectors with precious metals to reduce contact resistance and increase durability is a significant manufacturing expense without a proportional improvement in electrical performance.

Innovation Solution

The electrical connector design differentiates between signal and ground contact plating, using fewer or no layers of expensive materials on ground contacts, which have a higher contact resistance, while maintaining low resistance on signal contacts through multiple layers of specific materials like nickel and gold, thereby reducing overall plating costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If signal and ground contacts are plated with precious metals to reduce contact resistance, then electrical performance is improved, but manufacturing cost increases

Engineering Contradiction:
Improveelectrical performanceVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies different plating strategies to different contact types: signal contacts receive full precious metal plating (gold over palladium-nickel over nickel) to ensure low contact resistance for high-speed data transmission, while ground contacts receive reduced or alternative plating (nickel only or thinner gold layer) since their higher contact resistance does not adversely affect electrical performance. This local differentiation maintains overall connector reliability while reducing manufacturing costs.

Inventive Principle:
Principle #3Local quality

2Reliability

If ground contacts are plated with expensive materials to reduce contact resistance, then contact resistance decreases, but electrical performance does not improve proportionally

Engineering Contradiction:
Improvecontact resistanceVSAvoidcost-effectiveness
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent changes the plating parameters for ground contacts compared to signal contacts by reducing the thickness or eliminating the precious metal layers (gold and palladium-nickel) on ground contacts, using only nickel plating or thinner gold layers. This parameter change demonstrates that the high contact resistance of ground contacts does not adversely affect high-speed data transmission performance, making the plating process more cost-effective.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs without compromising high-frequency electrical performance, as the higher ground contact resistance does not adversely affect signal transmission speed or reliability, and the use of less expensive materials for ground contacts lowers the overall plating expense.

Implementation Method 1

The base materials of the signal and ground contacts of higher-speed connectors are often plated with one or more other materials (e.g., precious metals, alloys thereof, and/or the like) that provide the contacts with a lower contact resistance.

Methodology Applied
Scientific EffectElectroplating: Electroplating

Implementation Method 2

the base material of the electrical contacts of some connectors is plated with one or more materials (e.g., nickel (Ni), alloys thereof, and/or the like) that increase the durability of the contacts to reduce the wear generated from repeated mating and de-mating of the electrical connector.

Methodology Applied
Scientific EffectCorrosion resistance:

Data Source

PatentUS11108179B2Electrical connector with plated signal contacts
Publication Date: 2021.08.31 TE CONNECTIVITY SOLUTIONS GMBH
  • US11108179B2 patent drawing
  • US11108179B2 patent drawing
  • US11108179B2 patent drawing

AI summary

An electrical connector includes a housing and contact modules held by the housing. The contact modules include ground shields having ground contacts. The contact modules have a dielectric carrier that holds signal contacts. The ground contacts are configured for mating with corresponding ground contacts of a complementary mating connector, and are plated with a ground contact plating that includes at least one ground contact plating material. An interface between the ground contacts held and the corresponding ground contacts of the complementary mating connector has a first contact resistance. The signal contacts are configured for mating with corresponding signal contacts of the mating connector, and are plated with a signal contact plating. An interface between the signal contacts held and the signal contacts of the complimentary mating connector has a second contact resistance. The second contact resistance is lower than the first contact resistance.