Conductive External Connector Plating with Agitation-Controlled Shell

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Solution Overview

Problem

The miniaturization of integrated circuit dies due to advancements in semiconductor technology leads to the need for smaller external electrical connectors in higher densities, which poses challenges such as increased complexity and reliability issues in connector manufacturing.

Innovation Solution

A method for forming a conductive external connector involving the deposition of a metal pillar with solder on a substrate, utilizing a plating system with varying agitation levels to create a shell along the sidewalls, enhancing the connector's reliability and density by protecting the pillar and preventing oxidation and moisture ingress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If external electrical connectors are miniaturized and arranged in higher density, then integration density is improved, but manufacturing complexity and reliability issues increase

Engineering Contradiction:

Improveintegration densityVSAvoidconnector manufacturing complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

A shell structure is formed along the sidewalls of the connector pillar before the final connector structure is completed. This preliminary protective layer prevents oxidation and moisture ingress during subsequent manufacturing steps, addressing reliability issues that arise from miniaturization and higher density arrangements.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The shell structure provides localized protection specifically at the sidewalls of the connector pillar, where exposure to oxidizing environments occurs. This targeted approach protects critical areas without requiring complete redesign of the entire connector structure, thereby managing manufacturing complexity while improving reliability.

Inventive Principle:

Principle #3Local quality

2Productivity

If external electrical connectors are miniaturized and arranged in higher density, then integration density is improved, but reliability decreases due to oxidation and moisture ingress

Engineering Contradiction:

Improveintegration densityVSAvoidconnector reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The shell is formed in advance before the connector is exposed to environments that cause oxidation and moisture ingress. This preliminary protective structure prevents degradation during manufacturing and assembly processes, thereby maintaining reliability despite miniaturization and higher density arrangements.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

A shell structure is created along the sidewalls of the connector pillar to provide protective coverage. This shell acts as a barrier against oxidizing environments and moisture, preventing degradation of the underlying connector structure while maintaining the miniaturized, high-density form factor.

Inventive Principle:

Principle #30Flexible shells and thin films

3Manufacturing precision

If agitation level is increased during plating, then shell formation along sidewalls is improved, but manufacturing process complexity increases

Engineering Contradiction:

Improveshell formation precisionVSAvoidplating process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The plating process utilizes dynamic agitation to control the formation of the shell structure along the sidewalls. By varying the agitation level during plating, the process achieves precise shell formation that protects the connector pillar, while the agitation mechanism itself remains a standard plating process component, limiting the increase in overall manufacturing complexity.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the creation of reliable and densely packed external connectors with improved structural integrity and reliability, suitable for high-density semiconductor applications.

Implementation Method 1

plating a pillar on the substrate

Methodology Applied

Scientific EffectElectroplating: Electroplating

Implementation Method 2

plating solder on the external electrical connector structure

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS11527504B2Conductive external connector structure and method of forming

Publication Date: 2022.12.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.