USB Type-C Connector Post-Soldering Glue Injection
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Solution Overview
Problem
Existing USB Type C connectors face potential cracking due to bubbles in preformed waterproofing structures or thermal expansion coefficient differences between the metallic shell and glue when soldered onto a printed circuit board, leading to inadequate waterproofing.
Innovation Solution
The electrical connector design features a terminal module with a circumferential groove in the housing and an upward opening in the shell, allowing glue to be injected after soldering, forming a waterproof structure between the shell and housing to prevent cracking and enhance sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the waterproofing structure is formed before soldering, then the connector can be assembled with waterproofing, but cracking occurs due to bubbles or thermal expansion differences after soldering
Solution Approach 1:
The groove structure is pre-formed in the housing before soldering, but the waterproof glue is applied after soldering. This preliminary preparation of the groove allows the glue to be injected in optimal conditions without thermal interference, preventing both bubbles and cracking while achieving reliable waterproofing.
2Ease of manufacture
If the waterproofing structure is formed before soldering, then the connector assembly is complete, but bubbles are embedded in the waterproofing structure causing potential cracking
Solution Approach 1:
The groove is pre-formed to guide glue injection, but the actual glue application is delayed until after soldering. This approach maintains manufacturing efficiency through the pre-formed groove while ensuring high waterproofing quality by injecting glue under optimal conditions without thermal interference.
3Reliability
If glue is injected before soldering, then the waterproofing structure is formed early, but thermal expansion differences cause cracking between metallic shell and glue
Solution Approach 1:
The groove structure is prepared in advance, but the glue injection is postponed until after soldering completes. This timing strategy allows the metallic shell to reach thermal stability first, eliminating thermal expansion conflicts and ensuring stable material compatibility while maintaining waterproofing reliability.
4Strength
If the waterproofing structure is formed after soldering, then cracking is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The groove is pre-formed to simplify the later glue injection process. This preliminary structural preparation reduces the complexity of the post-soldering step, making the two-stage process (groove formation before soldering, glue injection after) more manageable and less complex than it initially appears.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures superior waterproofing between the connector components, preventing humidity penetration and maintaining structural integrity by forming the glue structure post-soldering, thus avoiding cracking issues.
Implementation Method 1
the shell forms an upward opening in a top wall and downwardly communicates with the groove so as to inject the glue into the groove through the opening to form the glue structure
Data Source
AI summary
A electrical connector includes a terminal module and a metallic shell receiving the terminal module. The terminal module includes an insulative housing and a plurality of terminals retained in the housing. The housing includes a base intimately enclosed within the shell, and a tongue extending forwardly from the base. The contact includes a front contacting section, a rear soldering section and a middle retaining section therebetween. The base forms in a peripheral surface a circumferential or race course like groove which is isolated from an exterior along a front-to-back direction, and the shell forms an upward opening in a top wall and downwardly communicates with the groove so as to inject the glue into the groove through the opening to form the glue structure only after the connector is soldered upon the printed circuit board.