High Density Connector Assembly With Preformed Cable Bends
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Solution Overview
Problem
The challenge is to increase the data carrying capacity of connector assemblies without altering the standardized size of the metal shell, specifically for QSFP and QSFP-DD interfaces, while maintaining high signal speed and signal integrity.
Innovation Solution
A connector assembly design with a reduced terminal array pitch and minimized component count, featuring a housing with a circuit board and conductive pads, where cables with preformed bends are soldered to pads, and a pull tab mechanism is integrated to optimize cable arrangement within the limited space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the terminal array pitch is reduced to increase cable density, then the data carrying capacity increases, but the signal integrity and impedance matching may deteriorate
Solution Approach 1:
The patent applies local quality by creating a dedicated shielding structure specifically for the high-density terminal array region. The shield cage is positioned adjacent to the circuit board and contains multiple shielding elements that locally address the electromagnetic interference problem in the high-density area without affecting other parts of the connector assembly.
Solution Approach 2:
The shield cage acts as an intermediary element between the high-density terminal array and the external environment. It mediates the electromagnetic field interactions by containing the signals within a controlled environment, preventing interference while allowing the high-density configuration to function properly.
2Quantity of substance
If more cables are fitted into the limited space, then the data carrying capacity increases, but the available cross section space for each cable decreases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of cables to a three-dimensional configuration by implementing vertical stacking of terminal rows and layers. The circuit board contains multiple rows of terminals arranged in different vertical positions, and the shield cage provides vertical containment, effectively utilizing the Z-dimension to increase cable density within the same footprint.
Solution Approach 2:
The shield cage structure nests multiple shielding elements and cable pathways within its confines. The configuration allows cables and terminals to be nested in a compact arrangement where multiple rows and layers are contained within the bounded space of the shield cage, maximizing space utilization.
3Quantity of substance
If the terminal array pitch is reduced, then the cable density increases, but the component count and manufacturing complexity increase
Solution Approach 1:
The shield cage serves multiple functions simultaneously: it provides electromagnetic shielding, defines the structural boundary for the high-density terminal array, and organizes the cable pathways. This multi-functionality reduces the need for additional separate components that would otherwise be required to achieve the same high-density configuration.
Solution Approach 2:
The terminal array is segmented into multiple rows and layers, with each row containing a reduced pitch of terminals. The shield cage is also segmented into multiple shielding elements that correspond to different sections of the terminal array, allowing for modular manufacturing and assembly while achieving high overall density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for higher cable density within the existing space, maintaining high signal speed and signal integrity, and enabling efficient data transmission without compromising impedance matching.
Implementation Method 1
A vertical separation between the recess and the circuit board being equal to or greater than three times an average thickness of the cable
Data Source
AI summary
A connector assembly includes, a housing, a circuit board that includes a conductive front pad and a conductive rear pad electrically connected to the front pad, and a cable that includes an insulated conductor having a conductor surrounded by an insulating material. The conductor has a diameter not greater than 24 AWG. The uninsulated front end of the conductor is terminated at the rear pad and includes a preformed bend. The connector assembly also includes a recess formed in an external surface and on a lateral side of the housing. The recess is designed to receive and house a spring member of a pull tab that is assembled to the housing. The vertical separation between the recess and the circuit board is h, the average thickness of the cable is t, and h≥3t. The preformed bend may include first and second portions connected by a substantially flattened joint.