Connector Protrusions Prevent Short-Circuits at Narrow Pitches
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Solution Overview
Problem
Existing connectors face challenges in firm mounting on substrates due to potential short-circuits and loose connections caused by insulating coatings and solder bridges, especially at narrow pitches.
Innovation Solution
A connector design featuring a metal plate with an insulating layer and conductive patterns, where protrusions on the substrate-facing surface allow for firm contact by preventing burial in insulating coatings and creating gaps, thereby suppressing short-circuits and enabling narrow-pitch mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pitch between contacts is reduced, then miniaturization is improved, but short-circuit risk increases
Solution Approach 1:
The insulating layer acts as an intermediary element that is strategically placed between closely spaced conductive patterns and connection parts. This mediator prevents short-circuits while allowing narrow pitch mounting, enabling miniaturization without increasing short-circuit risk
2Ease of manufacture
If the connection part is flat, then manufacturing is simplified, but contact firmness deteriorates due to burial in insulating coating
Solution Approach 1:
The connection parts are pre-formed as protrusions before the insulating layer is applied. This preliminary action ensures that the connection parts maintain their elevated position and protruding shape even after the insulating coating is formed, preventing burial and ensuring firm contact while keeping the manufacturing process relatively simple
Data Source
AI summary
Provided is a connector that can be firmly mounted on the substrate. A plug connector is mounted on a plug substrate while making a metal plate function as a plurality of contacts by an insulting layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer. A plurality of protrusions that protrude toward the plug substrate are formed on a substrate opposing surface, which is a surface opposite to the plug substrate. The plurality of conductive patterns are formed to respectively overlap the plurality of protrusions.