Connector Recess in IC Packaging for Alignment Tolerance
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Solution Overview
Problem
The mass production of stacked integrated circuits is hindered by the shrinking sizes of components, leading to decreased tolerances and reliability due to improper connections, which necessitates a solution for stricter tolerances and improved performance in integrated circuit packaging systems.
Innovation Solution
The method involves providing a substrate with a connection post, mounting an integrated circuit die, molding an encapsulation, and forming a connector recess around the connection post to expose a portion of its side, which helps compensate for misalignment of solder balls and improves connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If component sizes are reduced to achieve smaller and thinner packages, then packaging size is reduced, but connection reliability deteriorates due to decreased tolerances
Solution Approach 1:
The patent applies local quality by creating a connector recess with different geometric properties at different locations. The recess provides a localized enlarged tolerance zone around the connection post, while the rest of the encapsulation maintains its original compact form. This allows the solder ball connection area to have higher tolerance requirements met without increasing the overall package size.
Solution Approach 2:
The patent introduces a new dimensional feature by forming a connector recess that creates a three-dimensional space around the connection post. This recess extends in multiple directions (radially and vertically) to provide alignment compensation in various axes, effectively adding tolerance dimensions without increasing the planar footprint of the package.
2Volume of moving object
If component sizes are reduced to achieve smaller and thinner packages, then packaging size is reduced, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The connector recess acts as a pre-designed cushioning feature that anticipates potential misalignment issues. By providing an enlarged tolerance zone before the solder ball connection is made, the design compensates for manufacturing variations that would otherwise require extremely tight tolerances, thereby reducing the difficulty of maintaining manufacturing precision.
Solution Approach 2:
The patent changes the geometric parameters of the encapsulation by introducing a connector recess with specific dimensional characteristics. This recess modifies the local tolerance parameters, allowing for greater variation in connection post position while maintaining acceptable alignment, thus reducing the stringency of manufacturing precision requirements.
3Reliability
If stricter tolerances are implemented to improve connection reliability, then connection reliability improves, but device complexity increases
Solution Approach 1:
Rather than implementing stricter tolerances throughout the entire package, the patent applies the tolerance compensation feature locally at the connection post area through the connector recess. This localized approach achieves improved connection reliability without requiring complex tolerance control across all components, thereby avoiding increased device complexity.
Solution Approach 2:
The connector recess serves as an intermediary structure between the connection post and the solder ball. It mediates the alignment relationship by providing a geometric feature that guides and accommodates the solder ball, reducing the need for precise direct alignment between the connection post and solder ball, thus simplifying the overall packaging structure.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a connection post on the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; molding an encapsulation on the integrated circuit die and the connection post; and forming a connector recess in the encapsulation by removing the encapsulation around the connection post exposing a portion of the post side.