Electronic Card Connector Segmented Soldering Terminals

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Solution Overview

Problem

Conventional electronic card connectors face issues with insufficient mechanical strength due to low solder connection strength, which is exacerbated by limited space on printed circuit boards, leading to compromised connection strength and increased connector size.

Innovation Solution

The design incorporates an insulating body with terminals featuring a spring portion, a first soldering portion recessed in the base, and a second soldering portion extending from the base, forming slits to increase solderable area, allowing for enhanced attachment to the PCB through increased exposure of soldering surfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If reinforcing leads are provided to increase connection strength, then the mechanical strength of solder connections is improved, but the printed circuit board area required increases

Engineering Contradiction:
Improveconnection strengthVSAvoidprinted circuit board area
Core Design Contradiction:
StrengthVSArea of stationary object

Solution Approach 1:

The soldering portion is divided into multiple segments (first soldering portion and second soldering portion) that are separated from each other, allowing each segment to be independently soldered to the printed circuit board. This segmentation increases the total solderable area and connection strength without requiring a single large continuous area, thus resolving the contradiction between connection strength and board area usage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The soldering portions extend in multiple directions (lengthwise and widthwise) from the terminal body, utilizing two-dimensional space more efficiently. By arranging soldering portions at different orientations and positions, the design maximizes solderable area within a compact footprint, addressing the contradiction between needing sufficient solder area and minimizing board space.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If terminals are closely arrayed to reduce connector size, then the compactness is improved, but the solderable area is reduced due to limited surrounding area

Engineering Contradiction:
Improveconnector sizeVSAvoidsolderable area
Core Design Contradiction:
Volume of moving objectVSArea of stationary object

Solution Approach 1:

By separating the soldering function into multiple distinct portions (first and second soldering portions) positioned at different locations relative to the terminal body, the design increases the total solderable area available for each terminal. This allows terminals to be closely arrayed while each terminal still has sufficient soldering surface area, resolving the contradiction between compact connector size and adequate solderable area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The soldering portions are strategically positioned at specific locations (opposite ends of the terminal base) to maximize local solderable area. This localized optimization of soldering surfaces allows each terminal to have sufficient soldering capability even when terminals are densely packed, enabling compact connector design without sacrificing solderable area.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If the first soldering portion is bent to contact the contact pad, then the soldering ability is improved, but the bent section occupies significant portion reducing solderable area

Engineering Contradiction:
Improvesoldering abilityVSAvoidsolderable area
Core Design Contradiction:
Ease of manufactureVSArea of stationary object

Solution Approach 1:

The soldering function is segmented into multiple portions, with at least one soldering portion (the second soldering portion) maintaining a substantially flat configuration that maximizes solderable area. This segmentation allows the connector to achieve adequate soldering capability through multiple contact points while preserving maximum solder surface area, resolving the contradiction between soldering ability and solderable area.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of bending a single soldering portion in one direction, the design uses multiple soldering portions positioned at different locations and orientations. This multi-dimensional arrangement provides sufficient soldering capability through distributed contact points while each portion maintains a flat, solder-friendly surface, eliminating the need for large bent sections that would reduce solderable area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9048593B2Electronic card connector
Publication Date: 2015.06.02 MOLEX INC
  • US9048593B2 patent drawing
  • US9048593B2 patent drawing
  • US9048593B2 patent drawing

AI summary

An electronic card connector comprises an insulating body defining a bottom surface and a top surface opposite to the bottom surface, and a plurality of terminals contained in the insulating body. Each terminal comprises a base comprising a main portion, a spring portion extending from the base, a contact portion extending from the spring portion to outside of the insulating body, a first soldering portion recessed in a first end of the base and a second soldering portion separated from the first soldering portion. The first soldering portion and the main portion form a slit therebetween.