Electrical Connector Selective Plating to Prevent Flux Rise
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Solution Overview
Problem
Existing electrical connectors with terminals integrally formed and held by a housing face issues such as flux rising during soldering, leading to poor contact reliability and reduced retention force due to gaps between the housing and terminals, and potential deformation and contamination from plating processes.
Innovation Solution
The electrical connector design features terminals with a first surface plated for contact and connection, while a second surface adjacent to the housing remains unplated to prevent flux rise and contamination, with plating occurring after integral formation and separation from the carrier to avoid material adherence and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If all surfaces of the terminals are plated before integral formation with the housing, then electrical contact characteristic is improved, but flux is likely to rise during soldering and enter gaps between housing and terminals
Solution Approach 1:
The patent applies local quality by selectively plating only specific surfaces of the terminal portions. The first surface (contact surface) is plated to ensure good electrical contact, while the second surface (side surface adjacent to housing) is not plated. This localized plating approach maintains electrical reliability while preventing flux from wicking along the unplated surface into gaps between the housing and terminals during soldering.
2Ease of manufacture
If terminals are plated after being bent to form, then manufacturing process is simplified, but terminals are likely to be pressured and deformed when they collide with each other or surroundings
Solution Approach 1:
The patent applies preliminary action by performing the plating process on the terminal portions while they are still in their formed state with the carrier, before final assembly. The terminal portions are plated after bending but while still supported by the carrier structure, which provides protection during handling and assembly. This timing of plating maintains manufacturing simplicity while reducing the risk of deformation during subsequent collision or assembly operations.
3Volume of moving object
If the size or height of the connector is reduced, then compactness is improved, but contact between terminals and housing becomes poor and gaps are formed
Solution Approach 1:
The patent applies local quality by differentiating the treatment of different terminal surfaces. The first surface (contact surface) is plated to ensure reliable electrical contact with the housing, while the second surface (side surface) remains unplated. This selective plating ensures that even in compact connectors with reduced gaps, the critical contact interfaces maintain high reliability through proper plating, while the unplated side surfaces prevent flux contamination.
4Productivity
If material of the housing or residue and dust generated by plating adheres to the terminals, then manufacturing process is complete, but contact of the terminals becomes poor
Solution Approach 1:
The patent applies local quality by plating only the first surface (contact surface) of the terminal portions while leaving the second surface (side surface adjacent to housing) unplated. By not plating the side surface that contacts the housing, the patent eliminates the source of plating residue and dust that would otherwise adhere to the housing contact area and degrade contact quality. This selective approach maintains manufacturing efficiency while preventing contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances electrical contact and solder adhesion characteristics, reduces gaps between the housing and terminals, and prevents flux entry, thereby improving reliability and retention force while minimizing terminal deformation and contamination risks.
Implementation Method 1
each of the terminals is provided with a first surface and a second surface. The first surface does not contact with the housing and is plated, while the second surface contacts with the housing and is not plated
Data Source
AI summary
An electrical connector comprises a housing and a terminal held by the housing. The terminal is provided with a first surface exposed form the housing and a second surface contacted with the housing. The first surface is plated, and the second surface is not plated.