Waterproof Metal Shell Connector with Semipermeable Venting
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Solution Overview
Problem
Electrical connector assemblies in existing technologies face issues with heat dissipation and waterproofing, leading to reliability problems and user discomfort due to accumulated heat and potential liquid ingress, which affects signal transmission and chip performance.
Innovation Solution
Incorporating a metal shell with through holes, each equipped with a waterproof layer made of Gore-Tex material and a shielding layer, allowing for heat dissipation and preventing liquid entry, while a thermally conductive sheet enhances heat transfer between the chip and the metal shell, and a plastic shell provides additional protection and heat dissipation pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the metal shell is sealed to prevent liquid ingress, then waterproofing is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent applies a waterproof membrane (thin film) that selectively allows heat transfer while blocking liquid penetration. This membrane is integrated into the metal shell structure, enabling the shell to maintain both waterproofing and heat dissipation functions simultaneously through the film's selective permeability properties.
Solution Approach 2:
The patent combines metal shell material with waterproof membrane material to create a composite structure. This composite enables both liquid barrier functionality and thermal transfer capability, resolving the contradiction between waterproofing and heat dissipation by integrating materials with complementary properties.
2Temperature
If through holes are added to the metal shell for heat dissipation, then heat dissipation is improved, but liquid ingress resistance deteriorates
Solution Approach 1:
The waterproof membrane is integrated into the through holes of the metal shell, allowing heat to pass through the holes while the membrane blocks liquid ingress. This maintains heat dissipation pathways while preventing liquid entry through the same openings.
Solution Approach 2:
The patent applies different properties to different parts of the metal shell: the base shell provides structural protection and liquid barrier, while the through holes provide heat dissipation pathways. The waterproof membrane locally modifies the through hole regions to maintain both functions simultaneously.
3Productivity
If the chip operates at higher speed with increased power, then processing performance is improved, but heat generation increases
Solution Approach 1:
The patent extracts heat away from the chip by providing dedicated heat dissipation pathways through the metal shell with through holes. This separates the heat generation source (chip) from the heat accumulation zone (interior of shell) by creating direct thermal transfer paths to the exterior environment.
Solution Approach 2:
The patent establishes continuous heat dissipation through the metal shell structure with through holes that allow sustained thermal transfer. This continuous heat removal action prevents temperature accumulation that would otherwise occur during high-speed chip operation, enabling sustained high performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat, prevents liquid ingress, and enhances signal reliability by ensuring efficient heat transfer and electromagnetic interference resistance, thereby prolonging the service life of the electrical connector and chip.
Implementation Method 1
each of the at least one through hole is provided with a waterproof layer preventing liquid from passing from an exterior of the metal shell to an interior of the metal shell and enabling gas to pass between the interior and the exterior of the metal shell
Implementation Method 2
a thermally conductive sheet is provided between the metal shell and the at least one chip, and the at least one chip is thermally conducted with the metal shell via the thermally conductive sheet
Implementation Method 3
The waterproof layer enables heat generated by the electrical connector and the chip to be dissipated to an external environment via the through hole for heat exchange with external air
Data Source
AI summary
An electrical connector assembly includes: a circuit board, provided with at least one chip; an electrical connector, electrically connected to one end of the circuit board, and used to be mated with a mating connector; and a metal shell, covering the circuit board and the electrical connector. The metal shell is provided with at least one through hole running therethrough. Each through hole is provided with a waterproof layer preventing liquid from passing from an exterior of the metal shell to an interior of the metal shell and enabling gas to pass between the interior and the exterior of the metal shell, thereby achieving water proofing and heat dissipation, avoiding malfunctioning of the electrical connector and the chip due to excess temperature or liquid entry, ensuring the reliability of signal transmission between the electrical connector and the chip, and prolonging the service lives of the electrical connector and the chip.