Modular Connector Sensor Module Layout for Protection and Cooling
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Solution Overview
Problem
Existing sensor modules for modular connectors lack enhanced properties for sensor protection, positioning flexibility, and efficient cooling, with complex assembly processes.
Innovation Solution
A sensor module design featuring a carrier housing with a receiving space and a printed circuit board that extends partially within and outside the space, allowing sensor placement based on environmental needs, enhanced cooling through larger air volume exposure, and simplified assembly via form-fit connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the printed circuit board is completely enclosed within the receiving space, then sensor protection from ambient influences is improved, but cooling efficiency deteriorates due to limited air volume
Solution Approach 1:
The printed circuit board is extended in the direction perpendicular to the front wall, creating a multi-dimensional arrangement where sensors can be positioned at different depths along the board. This allows sensors to be placed in regions with different thermal environments - some protected within the receiving space and others exposed to larger air volumes for cooling.
2Temperature
If the printed circuit board extends out of the receiving space, then cooling efficiency is improved through larger air volume exposure, but sensor protection from ambient influences deteriorates
Solution Approach 1:
Different sections of the printed circuit board provide different environmental conditions. Sensors requiring protection are placed on portions within the receiving space, while sensors benefiting from cooling are placed on portions extending outward. Each sensor location has optimized local quality matching its functional requirements.
3Device complexity
If the printed circuit board is completely mounted within the receiving space, then assembly complexity is reduced, but ease of manipulation during assembly deteriorates due to limited access
Solution Approach 1:
The printed circuit board utilizes the third dimension by extending outward from the receiving space through the opening. This provides accessibility to assembly personnel for manipulation and connection tasks while the majority of the board remains within the compact receiving space, maintaining overall device compactness.
Data Source
AI summary
A sensor module (1) for a modular connector (2), in particular for a modular electrical and/or fluidic connector, having a carrier housing (3) with a receiving space (4) that is accessible via an opening (5) and that is closed with walls (6) and with an engagement structure (7) arranged on the outer side (8) of the carrier housing (3), and a sensor element (9) having a printed circuit board (10) and at least one sensor (11) to measure a physical property. The at least one sensor (11) is arranged on the printed circuit board (10). The printed circuit board (10) is mounted within the receiving space (4) to the carrier housing (3) and extends from the receiving space (4) through the opening (5) out of the receiving space (4).