Connector Shield Ground Path via Conductive Gasket

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Solution Overview

Problem

Existing electrical connector systems face challenges in optimizing the positioning and size of ground vias on circuit boards for improved electrical performance, as they are often dictated by manufacturability constraints rather than performance requirements, affecting impedance and cross-talk.

Innovation Solution

The use of a conductive gasket positioned along the mounting end of a shield body in connector assemblies to create a ground path between the shield body and the circuit board's ground plane, allowing for strategic placement and sizing of ground vias independent of contact tail sizes, thereby enhancing electrical characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If ground contacts and ground vias are positioned according to manufacturability constraints (rows and columns), then ease of manufacture is improved, but electrical performance (impedance control and cross-talk reduction) deteriorates

Engineering Contradiction:
Improveease of manufactureVSAvoidelectrical performance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The invention separates the ground via positioning function from the contact tail positioning function. Ground vias are no longer constrained to follow the row-column pattern of contact tails, allowing them to be strategically positioned around signal vias for optimal electrical performance while contact tails maintain their structured arrangement for manufacturability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention implements different positioning strategies for different elements: contact tails follow a regular row-column pattern for ease of manufacture, while ground vias are locally optimized to surround signal vias for optimal electrical performance. This local quality differentiation resolves the contradiction between manufacturability and electrical performance.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If ground via diameter is controlled by contact tail size, then ease of manufacture is improved, but electrical characteristics (impedance and cross-talk) deteriorate

Engineering Contradiction:
Improveease of manufactureVSAvoidelectrical characteristics
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The invention decouples the ground via diameter specification from contact tail dimensions. Ground via size is now independently controlled based on electrical performance requirements rather than being dictated by mechanical contact tail constraints, allowing separate optimization of manufacturing and electrical characteristics.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention changes the controlling parameter for ground via diameter from contact tail size (mechanical parameter) to electrical performance requirements (electrical parameter). This parameter change enables ground vias to be sized appropriately for impedance control and cross-talk reduction independent of contact tail dimensions.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If additional ground vias are positioned around signal vias, then electrical performance (impedance and cross-talk) is improved, but device complexity increases

Engineering Contradiction:
Improveelectrical performanceVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention separates ground via placement logic from contact tail arrangement. Ground vias can be added around signal vias without requiring corresponding changes to the contact tail structure, reducing the complexity increase by decoupling the two functions.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables more flexible and optimal placement of ground vias, improving impedance control and reducing cross-talk, while reducing the number of pins needed, thus enhancing the overall electrical performance and efficiency of the connector system.

Implementation Method 1

The conductive gasket engages the web portions of the shield body and is configured to define a ground path between the shield body and a ground plane of the circuit board

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS8002581B1Ground interface for a connector system
Publication Date: 2011.08.23 TE CONNECTIVITY SOLUTIONS GMBH
  • US8002581B1 patent drawing
  • US8002581B1 patent drawing
  • US8002581B1 patent drawing

AI summary

A connector assembly includes contacts with contact tails and mating portions opposite the contact tails. The contact tails are configured to be terminated to a circuit board. The mating portions are configured to be terminated to corresponding mating contacts of a mating connector assembly. The connector assembly also includes a shield body holding the contacts. The shield body has a mounting end configured to be mounted to the circuit board. The mounting portions have web portions extending between selected contacts. The connector assembly includes a conductive gasket positioned along the mounting end of the shield body. The conductive gasket engages the web portions of the shield body and is configured to define a ground path between the shield body and a ground plane of the circuit board.