Electrical Connector Vertical Shield Adjustment for SMT Bonding

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Solution Overview

Problem

Conventional electrical connectors with fixed metal shields and insulative housings often fail to maintain optimal contact with circuit boards due to deformation, affecting bonding quality during Surface Mounting Technique (SMT).

Innovation Solution

The electrical connector design allows vertical movement of the metal shield relative to the insulative housing, utilizing guide blocks and sliding slots for adjustable bonding, ensuring proper alignment and bonding of metal contact pins and the shield to the circuit board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the metal shield and electrically insulative housing are fixedly fastened together, then the structural stability is improved, but the bonding quality deteriorates due to inability to compensate for deformation

Engineering Contradiction:
Improvestructural stabilityVSAvoidbonding quality
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The patent applies the dynamics principle by making the metal shield vertically movable relative to the electrically insulative housing through guide blocks and sliding slots. This allows the shield to adjust its position dynamically during the bonding process, compensating for deformations and ensuring reliable bonding contact with the circuit board while maintaining structural stability through the guided movement mechanism.

Inventive Principle:
Principle #15Dynamics

2Reliability

If the metal shield is made vertically movable relative to the electrically insulative housing, then the bonding quality is improved, but the device complexity increases

Engineering Contradiction:
Improvebonding qualityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the connector into distinct components: the electrically insulative housing, the metal shield, guide blocks, and sliding slots. This segmentation allows the shield to move independently relative to the housing, enabling bonding quality improvement while keeping each component relatively simple in structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses guide blocks and sliding slots as intermediary elements that facilitate the vertical movement of the metal shield relative to the housing. These intermediaries enable the desired mobility for bonding quality without requiring a completely complex re design of the entire connector structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If the metal shield is vertically adjustable, then the adaptability to bonding variations is improved, but the manufacturing precision requirements increase

Engineering Contradiction:
Improveadaptability to bonding variationsVSAvoidmanufacturing precision
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by allowing the vertical position of the metal shield to be adjusted within a limited distance through the guide blocks and sliding slots mechanism. This enables adaptation to bonding variations by changing the position parameter while the guide structure maintains manufacturing precision through its constrained movement path.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS7138584B1Electrical connector
Publication Date: 2006.11.21 LOTES
  • US7138584B1 patent drawing
  • US7138584B1 patent drawing
  • US7138584B1 patent drawing

AI summary

An electrical connector is disclosed to include an electrically insulative housing, which houses a plurality of metal contact pins, each metal contact pin having a bottom bonding face protruding over the bottom side of the housing, a metal shield, which is coupled to the housing and has two bonding portions at two sides, and a bonding adjustment architecture provided between the metal shield and the housing for allowing vertical movement of the metal shield relative to the housing to adjust the elevation of the bonding portions so that the bonding portions and the bonding face of each metal contact pin can be positively bonded to a circuit board by SMT.