Connector Shielding for High-Speed Data EMI Suppression
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Solution Overview
Problem
As data transmission speeds increase, electromagnetic interference (EMI) caused by signal pins in connectors and cables deteriorates signal quality, leading to malfunctioning wireless communication functions and other apparatus issues, with existing technologies being insufficient in addressing this problem.
Innovation Solution
A connector design featuring a signal pin connected to a wiring pattern on a substrate with a grounded electric conductor shell that covers the signal pin, providing a shielding effect and suppressing EMI by forming a path for induction currents to flow out to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If data transmission speed is increased, then productivity is improved, but electromagnetic interference worsens signal quality
Solution Approach 1:
A ground pin is introduced as an intermediary element between the signal pin and the connector body. The ground pin serves as a mediator that provides a dedicated low-impedance path for electromagnetic interference to discharge to ground, preventing EMI from affecting wireless communication functions while allowing high-speed data transmission to proceed
Solution Approach 2:
The invention converts the harmful electromagnetic interference generated by high-speed signal pins into a beneficial discharge path through the ground pin. By providing a controlled route for EMI to flow to ground, the harmful electromagnetic energy is redirected away from sensitive wireless communication circuits, transforming the problem of EMI into a solution that protects other functions
2Device complexity
If signal pin structure is simplified, then device complexity is reduced, but EMI shielding capability is insufficient
Solution Approach 1:
The connector is segmented into functionally distinct elements: signal pins for data transmission, a separate ground pin for EMI discharge, and a connector body for structural support. This segmentation allows each component to perform its specific function optimally - the ground pin dedicated to EMI management while signal pins focus on high-speed data transmission, improving overall EMI shielding without excessive complexity
Solution Approach 2:
The ground pin is positioned locally adjacent to the signal pin, creating a localized EMI discharge path right where the electromagnetic interference is generated. This local quality approach provides targeted EMI shielding at the critical interface between signal pin and connector body, rather than requiring comprehensive shielding throughout the entire connector structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces signal quality deterioration by suppressing EMI, ensuring reliable data transmission and preventing apparatus malfunctions.
Implementation Method 1
a shell that is formed of an electric conductor and grounded to ground potential on the mounted substrate, in a manner that the shell covers the signal pin in a region in which the signal pin stretches toward the mounted substrate
Implementation Method 2
suppressing EMI by forming a path for induction currents to flow out to the substrate
Data Source
AI summary
To be able to further reduce deterioration in signal quality, there is provided a connector including: a signal pin (11) that is connected to a wiring pattern (15) on a mounted substrate (14) and that transmits a signal to an inside and an outside of any apparatus, the mounted substrate (14) having an end disposed in the apparatus; and a shell (13) that is formed of an electric conductor and grounded to ground potential on the mounted substrate (14), in a manner that the shell (13) covers the signal pin (11) in a region in which the signal pin (11) stretches toward the mounted substrate (14).