Electrical Connector Shielding Assembly and PCB Edge Protection
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Solution Overview
Problem
Cable assemblies face issues with cross-talk and electromagnetic interference due to exposed fibers and rough edges from the manufacturing process, which can lead to loose fibers entering contact areas and removing plating, and existing shielding methods do not provide comprehensive protection.
Innovation Solution
The use of a shielding assembly with a top shield, bottom shield, and intermediate shield, along with an overmolded plastic or conformal coating on the printed circuit board edges to encapsulate fibers and provide a smooth transition, and the incorporation of ground planes to maintain constant impedance and reduce crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the printed circuit board edge is left exposed after cutting and chamfering, then manufacturing is simpler and faster, but loose fibers can enter contact areas and rough tie bar edges can remove plating from mating contacts
Solution Approach 1:
The patent applies overmolded plastic or conformal coating to the printed circuit board edges before assembly to encapsulate loose fibers and smooth rough tie bar edges. This preliminary protective action prevents fibers from entering contact areas and prevents plating removal during subsequent insertion operations, resolving the contradiction between manufacturing simplicity and contact area protection.
2Device complexity
If traditional shielding methods are used, then device complexity is reduced, but cross-talk and electromagnetic interference are not adequately prevented
Solution Approach 1:
The patent divides the shielding function into multiple segments: cable shields wrapping individual wire pairs, a shielding assembly with top and bottom shields at the connector, and ground planes on the printed circuit board. This segmentation provides comprehensive electromagnetic protection while maintaining reasonable device complexity through modular implementation.
Solution Approach 2:
The patent applies different shielding measures to different locations: cable shields for wire pairs inside the cable, shielding assemblies for the connector area, and ground planes for the printed circuit board. Each location receives targeted shielding appropriate to its specific electromagnetic exposure requirements, effectively reducing cross-talk and interference.
3Ease of manufacture
If the printed circuit board uses a solid ground plane layer, then manufacturing is simpler, but impedance control becomes difficult and requires larger traces
Solution Approach 1:
The patent varies the ground plane structure locally: solid ground plane portions are used where smaller traces are needed, while non-solid ground plane portions with openings are used where larger pads are required. This local variation allows impedance control across different areas of the printed circuit board while maintaining manufacturing feasibility.
Data Source
AI summary
The cable assembly may include a plug connector, a cable, and a connector. The plug connector may include a housing and a board assembly. The board assembly may include a printed circuit board. The edge of the printed circuit board may be enclosed with a material. The material may be an overmolded plastic or a coating of a material. In order to reduce the crosstalk in the areas where the cable shield is removed, a shielding assembly may be used. The shielding assembly may provide 360 degrees of shielding for the wire pair at the location where the cable shield is removed. The printed circuit board may have a trace layer, a core layer, and a ground plane layer. The ground plane layer may have a portion which is a solid layer and another portion which is a non-solid layer.