Electrical Connector Soldered Fixation Reduces PCB Through Holes
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Solution Overview
Problem
Existing electrical connectors with press-fit terminals require multiple through holes on circuit boards, complicating high-frequency signal transmission and being unsuitable for frequent plugging in and out due to reliance on mechanical retention force.
Innovation Solution
An electrical connector design featuring an inner insulating body with a docking and mounting portion, and terminal modules with solderable tail portions that reduce the number of through holes on the circuit board, allowing for soldered fixation and improved signal transmission by minimizing crosstalk noise through strategic terminal placement and a metal shielding plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If press-fit terminals with through holes are used to fix the connector to the circuit board, then the connector can be mechanically retained, but the number of through holes increases and layout complexity increases
Solution Approach 1:
The patent extracts the through-hole requirement from the connector fixation system by using surface-mount technology with solder pads instead of press-fit terminals requiring through holes. This eliminates the need for multiple through holes in the circuit board, directly resolving the contradiction between mechanical retention and layout complexity.
Solution Approach 2:
The patent replaces the mechanical press-fit retention system with a solder-based fixation system. Instead of relying on elastic deformation and mechanical clamping force, the connector is fixed using solder joints, which provides reliable mechanical retention without requiring through holes, thus reducing layout complexity.
2Reliability
If press-fit terminals are used to fix the connector, then mechanical retention is achieved, but the connector is not suitable for frequent plugging and out due to reliance on retention force
Solution Approach 1:
The patent replaces the mechanical press-fit retention system with a solder-based fixation system. Solder joints provide permanent, reliable mechanical retention that is suitable for applications requiring frequent plugging and out, as the soldered connection maintains integrity over multiple connection cycles unlike press-fit terminals that rely on elastic retention force.
3Reliability
If multiple through holes are formed on the circuit board for press-fit terminals, then terminal fixation is achieved, but signal transmission quality deteriorates due to increased crosstalk
Solution Approach 1:
The patent extracts the through-hole structure from the terminal fixation system and replaces it with surface-mount terminals having solder pads. This eliminates the through holes that act as pathways for electrical crosstalk, thereby reducing harmful electrical interference while maintaining reliable terminal fixation through solder joints.
Solution Approach 2:
The patent introduces solder pads as an intermediary between the terminal and the circuit board, replacing the direct through-hole connection. This intermediary structure provides reliable electrical and mechanical connection while minimizing the pathway for signal crosstalk, thus reducing harmful electrical effects.
Data Source
AI summary
An electrical connector is fixed to a circuit board, and includes an inner insulating body and terminal modules. The inner insulating body includes a docking portion and a mounting portion. Each module has a carrier and terminals. The carrier is disposed on the mounting portion. The contacts are formed from a metal film and fixed to the carrier. Each terminal has a mating portion, a tail portion and a base portion connected between the mating portion and the tail portion. The mating portion extends from outside the carrier to inside the mating hole. The tail portion extends from outside the carrier to a surface of the circuit board. Each tail portion of a portion of the terminals has a soldering surface attached to the surface of the circuit board and a soldering pin passing through the surface of the circuit board respectively.