Conductive Connector Spacer Layer for High-Density Chip Bonding
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Solution Overview
Problem
As chip manufacturing technology advances, the increased number and density of terminals on chips pose challenges in improving the quality and yield of electronic apparatuses during the bonding process.
Innovation Solution
The proposed solution involves forming a spacer layer laterally around conductive connectors, which are bonded using a conductive bonding material with a lower melting point than the connectors. This configuration reduces the likelihood of electrical shorts and enhances bonding efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number and density of terminals on a chip are increased, then the functionality and integration of the electronic device are improved, but the risk of electrical shorts during bonding increases and manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The patent introduces a spacer layer as an intermediary component between adjacent conductive connectors. This spacer layer physically separates the connectors during the bonding process, preventing direct contact that would cause electrical shorts. The spacer acts as a mediator that enables high-density terminal arrangements while maintaining bonding reliability, as it can be removed after bonding without damaging the connectors.
Solution Approach 2:
The spacer layer is formed on the chip surface before the bonding process begins. This preliminary action prepares the surface by creating protective barriers in advance, ensuring that when bonding occurs, the conductive connectors are already positioned and protected to prevent shorts. The spacer is applied conformally before bonding, allowing subsequent removal to expose clean bonding surfaces.
2Productivity
If conductive bonding material is used to connect terminals, then bonding efficiency is improved, but electrical shorts may occur between adjacent connectors
Solution Approach 1:
The spacer layer serves as a protective intermediary during the bonding operation. While conductive bonding material is applied to connect terminals efficiently, the spacer physically prevents the bonding material from bridging adjacent connectors. This intermediary protection allows efficient bonding without the harmful side effect of electrical shorts.
Solution Approach 2:
The spacer layer is applied in advance to counteract the potential harmful effect of electrical shorts before bonding occurs. By pre-positioning this protective barrier, the patent prevents the bonding material from causing shorts, thereby enabling efficient bonding without the need for rework or repair.
3Reliability
If a spacer layer is formed around conductive connectors, then electrical shorts are reduced and bonding reliability is improved, but the device complexity and manufacturing steps increase
Solution Approach 1:
The patent segments the chip surface into distinct regions by introducing spacer layers between conductive connectors. This segmentation creates isolated bonding zones that prevent electrical interference. The spacer material itself is segmented and conformally applied to match the connector geometry, providing precise protection without excessive complexity.
Solution Approach 2:
The spacer layer is designed as a temporary structure that is discarded after serving its protective function. Following bonding, the spacer is removed (recovered) to expose the bonded connectors. This temporary addition of complexity is justified by the reliability improvement, as the spacer is only present during the critical bonding phase and is subsequently eliminated.
4Ease of manufacture
If the melting point of conductive bonding material is lower than conductive connectors, then bonding process is facilitated, but the spacer layer material selection becomes more constrained
Solution Approach 1:
The patent exploits the parameter difference in melting points between the bonding material and connector materials to enable the bonding process. By selecting a bonding material with a lower melting point, the bonding can occur at temperatures that do not damage the connectors. The spacer material is selected to withstand these bonding temperatures, creating a coordinated parameter strategy that facilitates manufacturing.
Solution Approach 2:
The patent employs composite material structures consisting of multiple layers with different thermal properties. The spacer layer is composed of materials that can withstand bonding temperatures, while the bonding material has a lower melting point for easy bonding. This composite approach allows versatile material selection by combining materials with complementary thermal characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a spacer layer and conductive bonding material with specific properties improves the electrical performance and yield of electronic devices by reducing the risk of electrical shorts and ensuring reliable bonding.
Implementation Method 1
a conductive bonding material with a lower melting point than the connectors
Implementation Method 2
bonded using a conductive bonding material with a lower melting point than the connectors
Implementation Method 3
forming a spacer layer laterally around conductive connectors... reduces the likelihood of electrical shorts
Data Source
AI summary
An electronic device including a substrate, a conductive connector, a conductive bonding material, and a spacer layer is provided. The conductive connector is disposed on the substrate. The conductive bonding material is disposed on the conductive connector. The spacer layer laterally covers the conductive connector.