Electrical Connector Spacer for Solder Ball Impedance Control
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Solution Overview
Problem
High differential impedance at solder balls in high-speed electrical connectors leads to unstable signal transmission, particularly in applications requiring speeds of at least 112 Gbps, due to the low dielectric constant of air exposing a part of the solder ball.
Innovation Solution
An electrical connector design featuring an insulation housing with conductive terminals and solder balls, where a spacer made of a dielectric material with a higher dielectric constant than air is positioned between adjacent solder balls to reduce differential impedance, using a plate-shaped member with receiving holes to enclose and space the solder balls, thereby stabilizing high-frequency signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are exposed to air in high-speed connectors, then the connector structure is simple and easy to manufacture, but the differential impedance becomes very high causing unstable signal transmission
Solution Approach 1:
A dielectric member is introduced as an intermediary substance between the solder balls and the surrounding environment. This dielectric member fills the spaces around and between adjacent solder balls, replacing air as the surrounding medium. The dielectric member has a dielectric constant higher than air, which effectively reduces the differential impedance at the solder ball interface and stabilizes high-speed signal transmission without requiring complex structural modifications to the connector housing.
Solution Approach 2:
The dielectric constant of the surrounding medium is changed from air (low dielectric constant) to a dielectric material with higher dielectric constant. This parameter change in the surrounding environment of the solder balls directly reduces the differential impedance, enabling stable signal transmission at high speeds such as 112 Gbps and above, while maintaining the simplicity of the overall connector structure.
2Reliability
If a dielectric member with higher dielectric constant than air is used to reduce differential impedance, then signal transmission stability improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The dielectric member is designed with a segmented structure featuring multiple receiving holes that correspond to individual solder balls. Each receiving hole is positioned to receive and surround a specific solder ball, creating localized impedance control at each solder ball interface. This segmented approach allows for precise control of differential impedance while maintaining manufacturing simplicity through modular assembly.
Solution Approach 2:
The dielectric member with receiving holes is positioned within the connector housing such that each receiving hole nestedly surrounds an individual solder ball. This nesting arrangement allows the dielectric member to be integrated into the existing connector structure without requiring complete redesign, facilitating easier manufacturing and assembly while achieving the desired impedance reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The spacer effectively reduces differential impedance at the solder balls, ensuring stable and reliable high-speed signal transmission of at least 112 Gbps by utilizing a dielectric material with a higher dielectric constant than air, enhancing the connector's performance in high-speed data communication.
Implementation Method 1
a spacer made of a dielectric material with a higher dielectric constant than air is positioned between adjacent solder balls to reduce differential impedance
Data Source
AI summary
An electrical connector includes an insulation housing having opposite first and second sides, an array of a plurality of conductive terminals, a plurality of solder balls, and a spacer. The conductive terminals are mounted within the insulation housing, with each conductive terminal having a contact segment and an opposite solder segment. The contact segment is at least partially exposed from the first side, and the solder segment is at least partially exposed from the second side. Each solder ball is connected to the solder segment of a corresponding conductive terminal. The spacer is disposed on the second side of the insulation housing and is positioned between adjacent solder balls.