Electrical Connector Spring Array for Reliable Substrate Contact
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Solution Overview
Problem
Existing electrical connectors for flat cables and printed circuit boards (PCBs) face challenges in maintaining consistent compressive contact force over time and temperature, leading to reduced reliability and current carrying capacity due to material relaxation and temperature exposure.
Innovation Solution
An electrical connector assembly featuring a housing with a planar first substrate and a second substrate with a ridge, aligned by a force application device comprising spring members with different radii of curvature, applying compressive contact forces to ensure intimate contact between the substrates, and an actuating member that increases force within a predetermined range, regardless of substrate thickness, while the connector's open box design minimizes material relaxation effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If polymeric materials are used for force application in the connector, then the connector structure can be simplified and easier to manufacture, but the compressive contact force becomes inconsistent over time and temperature due to material relaxation
Solution Approach 1:
The patent replaces polymeric materials with a spring array consisting of metallic spring members for force application. This substitution eliminates the material relaxation issues inherent in polymeric materials while maintaining the mechanical function of applying compressive contact force. The spring members are configured with specific radii of curvature to provide consistent force over time and temperature exposure.
Solution Approach 2:
The patent changes the physical parameters of the force application mechanism by using spring members with different radii of curvature (first radius and second radius). This parameter variation allows optimization of the spring geometry to achieve consistent compressive force while accommodating the technical requirements that polymeric materials cannot satisfy.
2Strength
If the connector uses a closed box design, then structural strength is improved, but material relaxation effects are increased leading to inconsistent compressive forces
Solution Approach 1:
The patent segments the force application function from the housing structure by introducing a separate spring array that can be contained within an open box housing. This segmentation allows the housing to provide structural support while the spring members independently provide consistent compressive force, eliminating the interaction between closed housing constraints and polymeric material relaxation.
3Reliability
If spring members with different radii of curvature are used, then consistent compressive force is achieved regardless of substrate thickness, but the device complexity increases
Solution Approach 1:
The patent merges multiple spring members with different radii of curvature into a single integrated spring array structure. This combination achieves consistent compressive force across varying substrate thicknesses while minimizing the increase in device complexity through unified design and configuration of the spring members.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable, high-contact-pressure connection with reduced wiping forces and increased current carrying capacity, maintaining consistent compressive forces even at elevated temperatures by using a spring array that is not dependent on polymeric materials for force application, thus enhancing the durability and performance of the electrical connection.
Implementation Method 1
a force application device configured to apply a compressive contact force to the first and second substrates... The force application device has a first spring member configured to apply the first compressive contact force to the first substrate and a second spring member configured to apply the second compressive contact force to the second substrate
Data Source
AI summary
An electrical connector assembly includes a housing that is configured to receive a planar first substrate, The first substrate includes an electrically conductive first contact region. The electrical connector assembly is further configured to receive a planar second substrate that includes an electrically conductive second contact region defining a ridge protruding from a surface of the second substrate. The housing is configured to align the first contact region with the second contact region. The electrical connector assembly also includes a force application device applying a compressive contact force to the first and second substrates, thereby putting the first contact region in intimate compressive contact with the second contact region.